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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic packages with nanoparticle joining. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 12, 2013: US08580607 (18 worldwide citation)

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic packages with nanoparticle joining. Tessera Research, February 2, 2012: US20120025365-A1

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...


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Belgacem Haba: Microelectronic packages with nanoparticle joining. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 19, 2016: US09397063

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...


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Belgacem Haba: Microelectronic packages with nanoparticle joining. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 12, 2015: US09030001

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...


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MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING. Tessera, March 20, 2014: US20140077351-A1

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...


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MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING. August 27, 2015: US20150243624-A1

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...