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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 10, 2012: US08093697 (59 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2012: US08329581 (35 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 20, 2014: US08728865 (34 worldwide citation)

A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and expos ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453157 (34 worldwide citation)

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 15, 2011: US08058101 (32 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


6
Belgacem Haba Belgacem (Bel) Haba
Giles Humpston, Guilian Gao, Belgacem Haba: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 18, 2010: US07719121 (31 worldwide citation)

A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive post ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, David Gibson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 10, 2011: US07939934 (19 worldwide citation)

An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2007: US07176043 (16 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away f ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 30, 2009: US07554206 (4 worldwide citation)

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 16, 2011: US07999397 (2 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...



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