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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659164 (54 worldwide citation)

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 28, 2014: US08637991 (15 worldwide citation)

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 7, 2014: US08623706 (1 worldwide citation)

A package for a microelectronic element 48, such as a semiconductor chip, has a dielectric mass 86 overlying the package substrate 56 and microelectronic element 48 and has top terminals 38 exposed at the top surface 94 of the dielectric mass 86. Traces 36a, 36b extending along edge surfaces 96, 108 ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, May 17, 2012: US20120119380-A1

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


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Belgacem Haba: Microelectronic package with terminals on dielectric mass. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 17, 2015: US08957527 (1 worldwide citation)

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


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HABA Belgacem: BOÎTIER MICRO-ÉLECTRONIQUE À BORNES IMPLANTÉES SUR UNE MASSE DIÉLECTRIQUE, MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS. TESSERA, HABA Belgacem, HUMKEY Charles H, May 24, 2012: WO/2012/067990

A package for a microelectronic element 48, such as a semiconductor chip, has a dielectric mass 86 overlying the package substrate 56 and microelectronic element 48 and has top terminals 38 exposed at the top surface 94 of the dielectric mass 86. Traces 36a, 36b extending along edge surfaces 96, 108 ...


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MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS. TESSERA, February 7, 2013: US20130032387-A1

A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably conn ...


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HABA BELGACEM: [fr] Boîtier microélectronique avec des terminaux sur masse diélectrique, [de] Mikroelektronisches Paket mit Anschlüssen auf der dielektrischen Masse, [en] Microelectronic package with terminals on dielectric mass. TESSERA, August 28, 2013: EP2631945-A2

[en] A package for a microelectronic element 48, such as a semiconductor chip, has a dielectric mass 86 overlying the package substrate 56 and microelectronic element 48 and has top terminals 38 exposed at the top surface 94 of the dielectric mass 86. Traces 36a, 36b extending along edge surfaces 96 ...


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MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS. TESSERA, October 3, 2013: US20130260513-A1

A package for a microelectronic element 48, such as a semiconductor chip, has a dielectric mass 86 overlying the package substrate 56 and microelectronic element 48 and has top terminals 38 exposed at the top surface 94 of the dielectric mass 86. Traces 36a, 36b extending along edge surfaces 96, 108 ...