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Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Giles Humpston: Microelectronic package having stacked semiconductor devices and a process for its fabrication. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 8, 2008: US07317249 (7 worldwide citation)

A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to ...


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Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Giles Humpston: Microelectronic package having stacked semiconductor devices and a process for its fabrication. Tessera, Tessera, LERNER DAVID et al, June 29, 2006: US20060138647-A1

A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to ...


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Crisp Richard D, Hara Belgacem, Humpston Giles: Microelectronic package having stacked semiconductor devices and a process for its fabrication. Tessera, Crisp Richard D, Hara Belgacem, Humpston Giles, BOTOS Richard J, July 6, 2006: WO/2006/071611

A microelectronic assembly includes a first microelectronic element (110, 125) having conductive posts (130) extending from one major surface, and a second microelectronic element (140) which is electrically interconnected with the first microelectronic element by the conductive posts. The interconn ...