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Belgacem Haba Belgacem (Bel) Haba
Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, June 11, 2013: US08461460

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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Belgacem Haba Belgacem (Bel) Haba
Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Tessera, Tessera, LERNER DAVID et al, January 14, 2010: US20100009554-A1

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, January 2, 2018: US09856135

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, December 20, 2016: US09524947

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Method of making a microelectronic interconnect element with decreased conductor spacing. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, December 2, 2014: US08900464

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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Ryu Chang Myung, Endo Kimitaka, Haba Belgacem, Kubota Yoichi: Microelectronic interconnect element with decreased conductor spacing. Tessera, Ryu Chang Myung, Endo Kimitaka, Haba Belgacem, Kubota Yoichi, Neff Daryl K, January 14, 2010: WO/2010/005592

A microelectronic interconnect element can include a plurality of first metal lines (110) and plurality of second metal lines (110') interleaved with the first metal lines (110). Each of the first and second metal lines has a surface (122), (120') extending within the same reference plane. The first ...


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Method of Making a Microelectronic Interconnect Element With Decreased Conductor Spacing. December 26, 2013: US20130341299-A1

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING. March 26, 2015: US20150087146-A1

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


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MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING. April 6, 2017: US20170096329-A1

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...