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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 19, 2009: US07534652 (6 worldwide citation)

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, IIyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145550-A1

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


3
Haba Belgacem, Mohammed Ilyas, Mitchell Craig S, Warner Michael, Thompson Jesse Burl: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, wu shaodun wang yang, January 14, 2009: CN200680049384

A dielectric structure is formed by a molding process, so that a first surface (32, 432) of a dielectric structure is shaped by contact with the mold. The opposite second surface (34, 434) of the dielectric structure is applied onto the front surface of a wafer element (38, 438). The dielectric stru ...


4
Haba Belgacem, Mohammed Ilyas, Mitchell Craig S, Warner Michael, Thompson Jesse Burl: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Haba Belgacem, Mohammed Ilyas, Mitchell Craig S, Warner Michael, Thompson Jesse Burl, DAVID Sidney, July 5, 2007: WO/2007/076099

A dielectric structure is formed by a molding process, so that a first surface (32, 432) of a dielectric structure is shaped by contact with the mold. The opposite second surface (34, 434) of the dielectric structure is applied onto the front surface of a wafer element (38, 438). The dielectric stru ...


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Haba Belgacem, Mohammed Ilyas, Mitchell Craig S, Warner Michael, Thompson Jesse Burl: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, October 9, 2008: KR1020087018403

A dielectric structure is formed by a molding process, so that a first surface (32, 432) of a dielectric structure is shaped by contact with the mold. The opposite second surface (34, 434) of the dielectric structure is applied onto the front surface of a wafer element (38, 438). The dielectric stru ...