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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell: Microelectronic assemblies having very fine pitch stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 29, 2011: US08067267 (6 worldwide citation)

A method of making a stacked microelectronic assembly includes providing a first microelectronic package that includes a first substrate having a first dielectric layer, conductive posts, and conductive traces extending along the surface of the first dielectric layer; providing a second microelectro ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell: Microelectronic assemblies having very fine pitch stacking. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070148819-A1

A microelectronic assembly includes two or more microelectronic packages stacked at a fine pitch, which is finer than the pitch that is possible when using solder balls for making the joint. Each stackable package desirably includes a substrate having pins projecting from one surface of the substrat ...


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Haba Belgacem, Mitchell Craig S: Microelectronic assemblies having very fine pitch stacking. Tessera, Haba Belgacem, Mitchell Craig S, DOHERTY Michael J, July 5, 2007: WO/2007/075678 (1 worldwide citation)

A method of making a stacked microelectronic assembly includes providing a first microelectronic package 122A having a first substrate 124A and conductive posts 130A extending from a surface 128A of the first substrate 124A, and providing a second microelectronic package 122B having a second substra ...


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Haba Belgacem, Mitchell Craig S: Microelectronic assemblies having very fine pitch stacking. Tessera, Chen Songtao, Wang Yang, March 11, 2009: CN200680053236

A method of making a stacked microelectronic assembly includes providing a first microelectronic package (122A) having a first substrate (124A) and conductive posts (130A) extending from a surface (128A) of the first substrate (124A), and providing a second microelectronic package (122B) having a se ...


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Haba Belgacem, Mitchell Craig S: Microelectronic assemblies having very fine pitch stacking. Tessera, September 3, 2008: KR1020087018100

A method of making a stacked microelectronic assembly includes providing a first microelectronic package (122A) having a first substrate (124A) and conductive posts (130A) extending from a surface (128A) of the first substrate (124A), and providing a second microelectronic package (122B) having a se ...