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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz Mentlik, July 6, 2010: US07749886 (8 worldwide citation)

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


2
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 14, 2012: US08115308 (1 worldwide citation)

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 24, 2014: US08759973

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic assemblies having compliancy. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 16, 2011: US07999379

A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openin ...


5
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, June 26, 2008: US20080150121-A1

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic assemblies having compliancy. Tessera, November 3, 2011: US20110266668-A1

A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openin ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic assemblies having compliancy. Tessera, Tessera, LERNER DAVID et al, August 31, 2006: US20060194365-A1

A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts accessible at the first surface, and a compliant layer overlying the first surface of the microelectronic element, the compliant layer having openin ...


8
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, April 19, 2012: US20120091582-A1

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


9
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic Assemblies Having Compliancy and Methods Therefor. Tessera, Tessera, LERNER DAVID et al, September 16, 2010: US20100230812-A1

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


10
Haba Belgacem: Microelectronic assemblies having compliancy. Tessera, puyi wen, February 20, 2008: CN200680005799

A microelectronic assembly includes a microelectronic element (20) , such as a semiconductor wafer or semiconductor chip, having a first surface (22) and contacts (24) accessible at the first surface (22) , and a compliant layer (26) overlying the first surface of the microelectronic element, the co ...