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Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, LErner David Littenberg Krumholz & Mentlik, May 4, 2010: US07709968 (36 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


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Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 10, 2013: US08531039 (1 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


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Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, Tessera, LERNER DAVID et al, August 5, 2010: US20100193970-A1

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


4
Belgacem Haba Belgacem (Bel) Haba
Philip Damberg, Belgacem Haba, David B Tuckerman, Teck Gyu Kang: Micro pin grid array with pin motion isolation. Tessera, Lerner David Litenberg Krumholz & Mentlik, August 11, 2005: US20050173805-A1

A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are ele ...


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Damberg Philip, Haba Belgacem, Tuckerman David B, Kang Teck Gyu: Micro pin grid array with pin motion isolation. Tessera, Damberg Philip, Haba Belgacem, Tuckerman David B, Kang Teck Gyu, DOHERTY Michael J, July 21, 2005: WO/2005/065238

A microelectronic package (20) includes a microelectronic element (22) having faces and contacts (26), a flexible substrate (30) overlying and spaced from a first face (24) of the microelectronic element (22), and a plurality of conductive terminals (42) exposed at a surface of the flexible substrat ...