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Eugene Fitzgerald
Eugene Fitzgerald, Matthew Currie: Methods for fabricating strained layers on semiconductor substrates. AmberWave Systems Corporation, Goodwin Procter, June 13, 2006: US07060632 (14 worldwide citation)

Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent porti ...


2
Eugene Fitzgerald
Eugene Fitzgerald, Matthew Currie: Methods for fabricating strained layers on semiconductor substrates. Testa Hurwitz & Thibeault, November 20, 2003: US20030215990-A1 (4 worldwide citation)

Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent porti ...


3
Eugene Fitzgerald
Eugene Fitzgerald, Matthew Currie: Methods for fabricating strained layers on semiconductor substrates. AmberWave Systems Corporation, Goodwin Procter, August 21, 2007: US07259108

Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent porti ...


4
Eugene Fitzgerald
Eugene Fitzgerald, Matthew Currie: Methods for fabricating strained layers on semiconductor substrates. Goodwin Procter, July 6, 2006: US20060148225-A1

Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent porti ...


5
Fitzgerald Eugene, Currie Matthew: Methods for fabricating strained layers on semiconductor substrates. Amberwave Systems Corporation, Fitzgerald Eugene, Currie Matthew, GAFF Brian M, September 25, 2003: WO/2003/079415

Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent porti ...