1
Jinbang Tang, Jong Kai Lin: Methods and apparatus for EMI shielding in multi-chip modules. Freescale Semiconductor, Ingrassia Fisher & Lorenz P C, January 19, 2010: US07648858 (39 worldwide citation)

Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic co ...


2
Michael Lambert, Jeff McFadden, Philip van Haaster: Methods and apparatus for EMI shielding. Laird Technologies, Pitney Hardin, March 22, 2005: US06870092 (36 worldwide citation)

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...


3
Mcfadden Jeff, Lambert Michael, Van Haaster Philip: Methods and apparatus for emi shielding. Laird Technologies, September 1, 2004: EP1452080-A1 (1 worldwide citation)

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...


4
Lambert Michael, Mcfadden Jeff, Van Haaster Philip: Methods and apparatus for emi shielding. Laird Technologies, guo saiyu, May 4, 2005: CN02826838 (1 worldwide citation)

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...


5
Michael R Lambert, Jeff McFadden, Philip van Haaster: Methods and apparatus for EMI shielding. Laird Technologies, Harness Dickey & Pierce, July 5, 2011: USRE042512

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...


6
Michael Lambert, Jeff McFadden, Philip van Haaster: Methods and apparatus for EMI shielding. Laird Technologies, Harness Dickey & Pierce, August 31, 2010: USRE041594

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...


7
Michael Lambert, Jeff McFadden, Philip van Haaster: Methods and apparatus for EMI shielding. Laird Technologies, Testa Hurwitz & Thibeault, October 16, 2003: US20030192715-A1

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...


8
Jinbang Tang, Jong Kai Lin: Methods and apparatus for emi shielding in multi-chip modules. Freescale Semiconductor, Ingrassia Fisher & Lorenz PC, December 25, 2008: US20080315371-A1

Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic co ...


9
Martin L Rapp, Reed Niederkorn, Paul Stus, Larry Creasy: Methods and apparatus for EMI shielding. Testa Hurwitz & Thibeault, April 25, 2002: US20020046849-A1

Disclosed are methods for manufacturing electromagnetic interference shields for use around access panels and doors in electronic equipment enclosures and elsewhere. The shields may include an electrically nonconductive substrate in combination with an electrically conductive element. In one embodim ...


10
Mcfadden Jeff, Lambert Michael, Van, Haaster Philip: Methods and apparatus for emi shielding. Laird Technologies, Mcfadden Jeff, Lambert Michael, Van, Haaster Philip, SULLIVAN Joseph P, June 12, 2003: WO/2003/049521

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared t ...