1
Michael Kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Method of separating two layers of material from one another and electronic components produced using this process. Siemens Aktiengesellschaft, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, May 6, 2003: US06559075 (203 worldwide citation)

A method of separating two layers of material from one another in such a way that the two separated layers of material are essentially fully preserved. An interface between the two layers of material at which the layers of material are to be separated, or a region in the vicinity of the interface, i ...


2
Michael Kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Method of separating two layers of material from one another. Siemens Aktiengesellschaft, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, May 25, 2004: US06740604 (73 worldwide citation)

A method of separating two layers of material from one another in such a way that the two separated layers of material are essentially fully preserved. An interface between the two layers of material at which the layers of material are to be separated, or a region in the vicinity of the interface, i ...


3
Michael Kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Method of producing a light-emitting diode. Siemens Aktiengesellschaft, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, December 13, 2005: US06974758 (8 worldwide citation)

A method of separating two layers of material from one another in such a way that the two separated layers of material are essentially fully preserved. An interface between the two layers of material at which the layers of material are to be separated, or a region in the vicinity of the interface, i ...


4
Michael Kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Electronic components produced by a method of separating two layers of material from one another. Osram, Cohen Pontani Lieberman & Pavane, May 11, 2010: US07713840 (4 worldwide citation)

A semiconductor body selected from the group consisting of a semiconductor layer, a semiconductor layer sequence or a semiconductor layer structure. The semiconductor body is transferred from a growth substrate to a support material by: exposing an interface between the growth substrate and the semi ...


5
Michael Kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Method of separating two layers of material from one another. Siemens Aktiengesellschaft, Werner H Stemer, June 5, 2003: US20030104678-A1 (1 worldwide citation)

A method of separating two layers of material from one another in such a way that the two separated layers of material are essentially fully preserved. An interface between the two layers of material at which the layers of material are to be separated, or a region in the vicinity of the interface, i ...


6
Michael kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Method of producing a light-emitting diode. Siemens Aktiengesellschaft, Lerner And Greenberg Pa, April 15, 2004: US20040072382-A1

A method of separating two layers of material from one another in such a way that the two separated layers of material are essentially fully preserved. An interface between the two layers of material at which the layers of material are to be separated, or a region in the vicinity of the interface, i ...


7
Michael Kelly, Oliver Ambacher, Martin Stutzmann, Martin Brandt, Roman Dimitrov, Robert Handschuh: Electronic components produced by a method of separating two layers of material from one another. Osram, Thomas Langer Esq, Cohen Pontani Lieberman & Pavane, July 10, 2008: US20080164571-A1

A semiconductor body selected from the group consisting of a semiconductor layer, a semiconductor layer sequence or a semiconductor layer structure. The semiconductor body is transferred from a growth substrate to a support material by: exposing an interface between the growth substrate and the semi ...