1
Wayne C Schar: Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby. Hewlett Packard Company, December 1, 1998: US05842273 (39 worldwide citation)

A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complete curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing th ...


2
Schar Wayne C: Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby. Hewlett Packard Company, sSCHUYLER Marc P, July 31, 1997: WO/1997/027646

A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complet curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the ...


3
Schar Wayne C: Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby. Hewlett Packard Co, November 11, 1998: EP0876689-A2

A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complet curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the ...