1
Salman Akram: Method of fabricating a multi-chip module. Micron Technology, Trask Britt, April 10, 2001: US06214641 (131 worldwide citation)

A lead-over-chip single-in-line memory module (LOC SIMM) and method of manufacturing is disclosed that provides for shortened wire bonds and ease of rework for unacceptable semiconductor dice. More specifically, the LOC SIMM of the present invention includes a plurality of slots extending through a ...


2
Jao Chin Cheng, Chih Peng Fan, David C H Cheng: Method of fabricating a multi-chip module package. Unimicron Technology, J C Patents, January 14, 2003: US06506633 (27 worldwide citation)

A method of fabricating a multi-chip module (MCM) package that can fabricate the substrate and the package simultaneously. The bonding pads of a chip are exposed by forming a patterned dielectric layer, and the bonding pads of the chip are electrically connected to the substrate by utilizing to an e ...


3
Anson J Call, Erwin B Cohen, Dany Minier, Wolfgang Sauter, David B Stone, Eric W Tremble: Split ball grid array pad for multi-chip modules. International Business Machines Corporation, Schmeiser Olsen & Watts, Steven J Meyers, April 25, 2017: US09633914

A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a fir ...


4
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES. March 16, 2017: US20170077000-A1

A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a fir ...


5
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES. May 18, 2017: US20170141078-A1

A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads inc ...



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