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Warren M Farnworth: Method for testing semiconductor packages using oxide penetrating test contacts. Micron Technology, Stephen A Gratton, September 4, 2001: US06285204 (68 worldwide citation)

A method for testing semiconductor packages using oxide penetrating test contacts is provided. The test contacts are attached to a burn-in board and include a base metal formed in compliant shape. In addition, the test contacts include a conductive layer having an abrasive grain material embedded th ...


2
Warren M Farnworth: Method for testing semiconductor packages using oxide penetrating test contacts. Micron Technology, Stephen A Gratton, June 6, 2000: US06072324 (10 worldwide citation)

A method for testing semiconductor packages using oxide penetrating test contacts is provided. The test contacts are attached to a burn-in board and include a base metal formed in compliant shape. In addition, the test contacts include a conductive layer having an abrasive grain material embedded th ...



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