1
Michael Renner, Lothar Brencher: Method for processing a carrier, a method for operating a plasma processing chamber, and a method for processing a semiconductor wafer. Infineon Technologies, Viering Jentschura & Partner mbB, January 10, 2017: US09543157

According to various embodiments, a method for processing a carrier may include: performing a dry etch process in a processing chamber to remove a first material from the carrier by an etchant, the processing chamber including an exposed inner surface including aluminum and the etchant including a h ...


2
METHOD FOR PROCESSING A CARRIER, A METHOD FOR OPERATING A PLASMA PROCESSING CHAMBER, AND A METHOD FOR PROCESSING A SEMICONDUCTOR WAFER. March 31, 2016: US20160093500-A1

According to various embodiments, a method for processing a carrier may include: performing a dry etch process in a processing chamber to remove a first material from the carrier by an etchant, the processing chamber including an exposed inner surface including aluminum and the etchant including a h ...



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