1
Adam L Cohen: Method for electrochemical fabrication. University of Southern California, Fish & Richardson P C, February 22, 2000: US06027630 (204 worldwide citation)

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first p ...


2
Adam L Cohen: Method for electrochemical fabrication. University of Southern California, Norman R Klivans, Dennis R Smalley, Skjerven Morrill, November 5, 2002: US06475369 (40 worldwide citation)

An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the ...


3
Adam L Cohen: Method for electrochemical fabrication. University of Southern California, Dennis R Smalley, September 14, 2004: US06790377 (39 worldwide citation)

An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the ...


4
Adam L Cohen: Method for electrochemical fabrication. University of Southern California, Dennis R Smalley, December 10, 2013: US08603316 (8 worldwide citation)

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first p ...


5
Adam L Cohen: Method for electrochemical fabrication. Microfabrica, Dennis R Smalley, April 1, 2008: US07351321 (4 worldwide citation)

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first p ...


6
Adam L Cohen: Method for electrochemical fabrication. University of Southern California, Dennis R Smalley, August 16, 2011: US07998331 (1 worldwide citation)

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first p ...


7
Michael S Lockard, Uri Frodis, Adam L Cohen, Richard T Chen: Miniature shredding tool for use in medical applications and methods for making. Microfabrica, Dennis R Smalley, Douglas C Limbach, March 6, 2018: US09907564

The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devic ...


8
Gregory P Schmitz, Michael S Lockard, Ming Ting Wu, Eric C Miller, Adam L Cohen: Counterfeiting deterrent and security devices, systems, and methods. Microfabrica, Dennis R Smalley, February 14, 2017: US09567682

A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the l ...


9
Ming Ting Wu, Rulon J Larsen III, Young Kim, Kieun Kim, Adam L Cohen, Ananda H Kumar, Michael S Lockard, Dennis R Smalley: Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties. University of Southern California, Dennis R Smalley, June 6, 2017: US09671429

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, ...


10
Elliott R Brown, John D Evans, Christopher A Bang, Adam L Cohen, Michael S Lockard, Dennis R Smalley, Morton Grosser: Method for fabricating miniature structures or devices such as RF and microwave components. Microfabrica, Dennis R Smalley, April 11, 2017: US09620834

Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer a ...