1
Homayoun Talieh, Cyprian Emeka Uzoh: Method and apparatus for plating and polishing a semiconductor substrate. Nutool, Pillsbury Winthrop, December 11, 2001: US06328872 (119 worldwide citation)

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conducti ...


2
Talieh Homayoun, Uzoh Cyprian Emeka: Method and apparatus for plating and polishing a semiconductor substrate. Nutool, JAKOPIN David A, October 12, 2000: WO/2000/059682 (2 worldwide citation)

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate (2) and then polishes the same substrate (2). This is achieved by providing multiple chambers (100, 200) in a single apparatus, where one chamber (100) can be used for platin ...


3
Homayoun Talieh, Cyprian Emeka Uzoh: Method and apparatus for plating and polishing a semiconductor substrate. NuTool, Pillsbury Winthrop, January 31, 2002: US20020011417-A1 (1 worldwide citation)

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conducti ...


4
Talieh Homayoun, Uzoh Cyprian Emeka: Method and apparatus for plating and polishing a semiconductor substrate. Nutool, January 9, 2002: EP1169162-A1

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate (2) and then polishes the same substrate (2). This is achieved by providing multiple chambers (100, 200) in a single apparatus, where one chamber (100) can be used for platin ...


5
H Talieh, Ce Uzoh: Method and apparatus for plating and polishing a semiconductor substrate. Nutool, liu zhibeng, May 29, 2002: CN00807964

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conducti ...


6
Talieh Homayoun, Uzoh Cyprian Emeka: Method and apparatus for plating and polishing a semiconductor substrate. Asm Nutool, December 17, 2001: KR1020017012505

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate (2) and then polishes the same substrate (2). This is achieved by providing multiple chambers (100, 200) in a single apparatus, where one chamber (100) can be used for platin ...