1
Javathu K Hassan, Alfred Mack, Michael R Wojtaszek: Method and apparatus for handling workpieces. International Business Machines Corporation, Frank C Leach Jr, Theodore E Galanthay, July 13, 1976: US03968885 (120 worldwide citation)

A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elev ...


2
Hassan Javathu K, Mack Alfred, Wojtaszek Michael R: Method and apparatus for handling workpieces. International Business Machines Corporation, Leach Jr Frank C, Galanthay Theodore E, April 1, 1975: US3874525 (83 worldwide citation)

A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elev ...


3
Method and apparatus for handling workpieces. Ibm, January 24, 1975: FR2234969-A1

A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elev ...


4
Reilly Joseph R: Methode et appareil pour la manutention des pieces a usiner, Method and apparatus for handling workpieces. Monsanto Company, May 1, 1979: CA1053716

ABSTRACT OF THE DISCLOSUREA process for handling workpieces by sequentially loading theminto holder portions of continuously moving carrier assemblies, simultaneouslyabruptly shifting a group of such holders to workpiece-release positions at adischarge station while continuing movement of the carrie ...


5
Christa Marie Bolig, Richard D Bunch, Yun Lin Hsiao, Timothy Joseph Neumann, Li Zheng: System, method, and apparatus for handle-free finger fixture for single slider post row-part debonding process. Hitachi Global Storage Technologies Netherlands, Bracewell & Patterson, June 16, 2005: US20050125995-A1

A system, method, and apparatus for handling workpieces such as hard disk drive sliders during a debonding process uses a fixture having two sets of finger-like projections that are interleaved. The sets are movable relative to each other to space apart the sliders after they are processed from thei ...


6
Ruuttu Jari, Törnroos Filip: Method and apparatus for handling workpieces in a manufacturing process. Ruuttu Jari, Törnroos Filip, BERGGREN OY, August 31, 2000: WO/2000/050212

Workpieces are treated in a manufacturing process, where separate workpieces are formed by solidification of liquid or viscous material in a mould (302). The successive workpieces form a band, in which a reinforcement (301) of a material other than the material to be solidified is interposed between ...