1
Homayoun Talieh: Method and apparatus for electro-chemical mechanical deposition. Nutool, Pillsbury Madison & Sutro, January 23, 2001: US06176992 (272 worldwide citation)

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surfa ...


2
Homayoun Talieh: Method and apparatus for electro-chemical mechanical deposition. ASM Nutool, Knobbe Martens Olson & Bear, June 7, 2005: US06902659 (34 worldwide citation)

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surfa ...


3
Homayoun Talieh: Method and apparatus for electro-chemical mechanical deposition. David Ashby, NuTool, May 22, 2003: US20030094364-A1

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surfa ...


4
Homayoun Talieh: Method and apparatus for electro-chemical mechanical deposition. David Ashby, NuTool, January 9, 2003: US20030006147-A1

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surfa ...