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Shawn W Snyder, Bernd J Neudecker, Paul C Brantner: Metal film encapsulation. Infinite Power Solutions, Fox Rothschild, Jeff E Schwartz, August 7, 2012: US08236443 (12 worldwide citation)

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.


2
Shawn W Snyder, Bernd J Neudecker, Paul C Brantner: Metal film encapsulation. Infinite Power Solutions, Jeff E Schwartz, Fox Rothschild, March 26, 2013: US08404376 (5 worldwide citation)

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.


3
Snyder Shawn W, Neudecker Bernd J, Brantner Paul C: Metal film encapsulation. Infinite Power Solution, Snyder Shawn W, Neudecker Bernd J, Brantner Paul C, SCHWARTZ Jeff E, September 20, 2007: WO/2007/106910 (1 worldwide citation)

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.


4
Raymond R Johnson, Shawn W Snyder, Paul C Brantner, Timothy J Bradow, Bernd J Neudecker: Thin film battery on an integrated circuit or circuit board and method thereof. Sapurast Research, Blakely Sokoloff Taylor & Zafman, April 25, 2017: US09634296

The present invention relates to flexible thin film batteries on semiconducting surface or the conductive or insulating packaging surface of a semiconductor device and methods of constructing such batteries. Electrochemical devices may be glued to a semiconducting surface or the conductive or insula ...


5
Shawn W Snyder, Paul C Brantner, Joseph A Keating, Timothy N Bradow, Prativadi B Narayan, Bernd J Neudecker: Robust metal film encapsulation. Infinite Power Solutions, Jeff E Schwartz, Fox Rothschild, March 12, 2013: US08394522

The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The pres ...


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Snyder Shawn W, Neudecker Bernd J, Brantner Paul C: Metal film encapsulation. Infinite Power Solutions, December 3, 2008: EP1997176-A2

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.


8
Shawn W Snyder, Bernd J Neudecker, Paul C Brantner: Metal film encapsulation. Infinite Power Solutions, Nixon Peabody, August 30, 2007: US20070202395-A1

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.


9
Shawn W Snyder, Paul C Brantner, Joseph A Keating, Timothy N Bradow, Prativadi B Narayan, Bernd J Neudecker: Robust metal film encapsulation. Dewey & LeBoeuf, October 23, 2008: US20080261107-A1

The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The pres ...


10
Shawn W Snyder, Bernd J Neudecker, Paul C Brantner: Metal Film Encapsulation. Infinite Power Solutions, Dewey & LeBoeuf, August 12, 2010: US20100203377-A1

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.