1
Richard E Huff: Membrane probe contact bump compliancy system. Hoya Corporation USA, Thomas E Schatzel, January 19, 1993: US05180977 (129 worldwide citation)

The present invention provides a membrane probe contact bump compliancy system implemented in an integrated circuit (IC) testing system to nondestructively test a wafer. This integrated circuit system includes a test controller which is capable of controlling and executing a set of test programs, a ...


2
Huff Richard E: Membrane probe contact bump compliancy system.. Hoya Corp Usa, June 9, 1993: EP0545070-A1 (2 worldwide citation)

The present invention provides a membrane probe contact bump compliancy system implemented in an integrated circuit (IC) testing system to nondestructively test a wafer. This integrated circuit system includes a test controller which is capable of controlling and executing a set of test programs, a ...