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Isaiah Oladeji
Isaiah O Oladeji, Scott Jessen, Joseph Ashley Taylor: Mask layer and interconnect structure for dual damascene semiconductor manufacturing. Beusse Brownlee Bowdoin & Wolter P A, April 3, 2003: US20030064582-A1 (1 worldwide citation)

A novel mask layer is used in the dual damascene construction of an interconnect structure of an integrated circuit device. The interconnect structure has a low-k dielectric material. The mask layer has a passivation film deposited on the low-k dielectric material, a barrier film is deposited over t ...


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Isaiah Oladeji
Isaiah O Oladeji, Scott Jessen, Joseph Ashley Taylor: Mask layer and interconnect structure for dual damascene semiconductor manufacturing. Beusse Brownlee Wolter Mora & Maire P A, September 2, 2004: US20040171256-A1

A novel mask layer is used in the dual damascene construction of an interconnect structure of an integrated circuit device. The interconnect structure has a low-k dielectric material. The mask layer has a passivation film deposited on the low-k dielectric material, a barrier film is deposited over t ...


3
Oladeji Isaiah O, Jessen Scott, Taylor Joseph Ashley: Mask layer and interconnect structure for dual damascene semiconductor manufacturing. Agere Systems, April 2, 2003: GB2380316-A (1 worldwide citation)

A mask layer 37 is used in the dual damascene construction of an interconnect structure of an integrated circuit device. The interconnect structure has a low-k dielectric material 31, 32. The mask layer has a passivation film 38 deposited on the low-k dielectric material 32, a barrier film 39 is dep ...


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Oladeji Isaiah O, Jessen Scott, Taylor Joseph Ashley: Mask layer and interconnect structure for dual damascene semiconductor manufacturing. Agere Systems, May 21, 2003: TW533474

A novel mask layer is used in the dual damascene construction of an interconnect structure of an integrated circuit device. The interconnect structure has a low-k dielectric material. The mask layer has a passivation film deposited on the low-k dielectric material, a barrier film is deposited over t ...


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