Kimiyuki Hayasaki, Masaki Inaba, Hisashi Fukai: Method and apparatus for correcting print density by printhead, printhead corrected by this apparatus, and printing apparatus using this printhead. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, July 25, 2000: US06094280 (95 worldwide citation)

A high-yield printhead where density unevenness is surely corrected taking into consideration various factors related to manufacturing processes of the printhead, a printer utilizing the printhead, and an apparatus and method for correcting print density unevenness by the printhead, are provided. Ac ...

Walter Dean Mieher, Ady Levy: Overlay alignment measurement mark. KLA Tencor Technologies Corporation, Beyer Weaver & Thomas, November 26, 2002: US06486954 (87 worldwide citation)

An alignment mark comprising a first test zone and a second test zone for measuring the relative position between different layers of a semiconductor device. The alignment mark is used to determine the overlay error between layers of a semiconductor wafer while minimizing measurement inaccuracies ca ...

Michael E Woolford, Dick J Sievert: Composite masonry block mold for use in block molding machines. Block Systems, Merchant Gould Smith Edell Welter & Schmidt, November 5, 1991: US05062610 (86 worldwide citation)

The invention includes block molds and manufacturing processes as well as a composite masonry block comprising a block body having an irregular trapezoidal shape and comprising a front surface and a back surface, an upper surface and a lower surface, and first and second sidewalls. Both the first an ...

Sai V Vishwanthaiah, Jonathan E Starr, Alexander D Taylor: Impedance control circuit. Sun Microsystems, Stephen A Terrille, Skjerven Morrill MacPherson Franklin & Friel, May 9, 2000: US06060907 (86 worldwide citation)

An impedance control circuit is provided which controls the output impedance of drivers which are coupled to the impedance control circuit. Accordingly, a desired driver output impedance can advantageously be established and maintained over a wide range of variations in operating conditions and manu ...

Gerald E Fitzgerald: Double walled baffle. Sika Corporation, Hovey Williams, May 7, 2002: US06382635 (84 worldwide citation)

An expandable baffle for sealing a cavity of an automobile is provided. The baffle includes a thermally expandable sealing material which has an expansion temperature similar to the temperatures achieved in specific stages of the automotive manufacturing processes (e.g., the paint bake stage). The i ...

Kobayashi Yasumasa: Device for production control and method for production control using the same.. Seiko Epson, May 27, 1992: EP0487419-A2 (83 worldwide citation)

The present invention comprises a device for production control and a method for production control for setting optimal priorities according to production conditions that may vary from moment to moment. According to the invention, a control means produces production instructions information accordin ...

Anton Mavretic, Andrew Ciszek, Joseph Stach: Apparatus for matching a variable load impedance with an RF power generator impedance. RF Power Products, Blakely Sokoloff Taylor & Zafman, August 5, 1997: US05654679 (83 worldwide citation)

An apparatus for matching the variable impedance of a load with the fixed impedance of a radio frequency (RF) power generator to provide maximum power transfer. The impedance matching network further allows an RF power generator to vary the frequency of the voltage applied to a load, e.g., a plasma ...

Kazuyoshi Nagayama, Toshihiro Ueki: Liquid crystal display device and method for manufacturing the same. International Business Machines Corporation, David Aker, Jay P Sbrollini, October 21, 1997: US05680187 (81 worldwide citation)

To obtain a liquid crystal display device which has no leakage of light and has excellent contrast in the minimum number of manufacturing processes. To obtain cell gap Ga on the array panel 12, first projecting sections 38A are formed in a black matrix 38, and, on the color filter panel 13, second p ...

Anthony L Coyle: Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly. Texas Instruments Incorporated, Michael K Skrehot, Wade James Brady III, Frederick J Telecky Jr, February 11, 2003: US06518089 (78 worldwide citation)

A robust, low inductance electronic package for small area semiconductor chips is provided which includes a flexible polymer film having electronic circuitry on one or more major surfaces, a bumped flip chip integrated circuit attached to the first surface, an array of solder balls to the second sur ...

Timothy J Brosnihan, Nesbitt W Hagood IV, Jasper Lodewyk Steyn, Jignesh Gandhi, John J Fijol, Richard S Payne, Roger Barton: Display apparatus and methods for manufacture thereof. Pixtronix, Ropes & Gray, July 29, 2008: US07405852 (77 worldwide citation)

Display devices incorporating shutter-based light modulators are disclosed along with methods of manufacturing such devices. The methods are compatible with thin-film manufacturing processes known in the art and result in displays having lower power-consumption.

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