31
James V Donadio III: Method for manufacturing a tubular medical device. Intratherapeutics, Merchant & Gould P C, February 22, 2000: US06027863 (127 worldwide citation)

Manufacturing processes for apparatus, including slotted hypotube, for use as a catheter, a guidewire, a catheter sheath for use with catheter introducers or a drug infusion catheter/guidewire are disclosed. The manufacturing process includes creating a pattern of slots or apertures in a flexible me ...


32
Kevin D Stoddard, Bradley D Schulze, Konstantinos Tsakalis: Run-to-run controller for use in microelectronic fabrication. Brooks Automation, Perman & Green, July 1, 2003: US06587744 (127 worldwide citation)

A automated run-to-run controller for controlling manufacturing processes comprises set of processing tools, a set of metrology tools for taking metrology measurements from the processing tools, and a supervising station for managing and controlling the processing tools. The supervising station comp ...


33
Bernard Warszawski: Material for light modulation and manufacturing processes. Alpine Polyvision, Mason Fenwick & Lawrence, October 15, 1991: US05056899 (125 worldwide citation)

An electrolytic material intended for a process relating to a light-modulating cell involving electrochromic reflection or transmission. The electrolytic material is a homogeneous mixture of solid consistency, comprising at least (a) a water-soluble salt or salts of one metal which can be cathodical ...


34
Francois J Henley, Nathan W Cheung: Silicon-on-silicon hybrid wafer assembly. Silicon Genesis Corporation, Townsend and Townsend and Crew, April 11, 2000: US06048411 (119 worldwide citation)

A hybrid silicon-on-silicon substrate. A thin film (2101) of single-crystal silicon is bonded to a target wafer (46). A high-quality bond is formed between the thin film and the target wafer during a high-temperature annealing process. It is believed that the high-temperature annealing process forms ...


35
Todd R Witkowski, Kurt A Dykema, Steven L Geerlings, Mark L Zeinstra: Wireless communications systems and method. Johnson Controls Technology Company, Foley & Lardner, August 14, 2007: US07257426 (119 worldwide citation)

A wireless communications system and method adapted for use in automotive applications for enabling automatic, high-speed, wireless voice and/or data communications link to be established between a wide variety of external devices and various electronic subsystems of a vehicle. The apparatus include ...


36
Silverbrook Kia: Cmos process compatible fabrication of print heads. Eastman Kodak Co, March 19, 1997: EP0763430-A2 (117 worldwide citation)

A manufacturing process for printing heads (50) which integrates many nozzles into a single monolithic silicon structure. The nozzles (200) are etched through the silicon substrate, allowing two dimensional arrays of nozzles (200) for printing. The manufacturing process can be based on existing CMOS ...


37
Sammy Mok, Fu Chiung Chong, Frank John Swiatowiec, Syamal Kumar Lahiri, Joseph Michael Haemer: Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs. NanoNexus, Michael A Glenn, Glenn Patent Group, July 12, 2005: US06917525 (116 worldwide citation)

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semicondu ...


38
Timothy A Fayram: Capacitor for an implantable cardiac defibrillator. Ventritex, Steven M Mitchell, Mark J Meltzer, June 4, 1996: US05522851 (116 worldwide citation)

A capacitor having a housing defining a chamber, and having at least two internal alignment elements in the chamber. A plurality of capacitor layers, each having alignment holes formed therein to precisely fit the housing's alignment elements, is positioned within the chamber, with the alignment hol ...


39
Shahram Mostafazadeh, Joseph O Smith: Lead frame design for increased chip pinout. National Semiconductor Corporation, Edward C Kwok, Skjerven Morrill Macpherson Franklin & Friel, March 7, 2000: US06034423 (114 worldwide citation)

An integrated circuit (IC) module incorporates a modified lead frame having a die attach platform, a plurality of leads extending away from the die attach platform, and a plurality of bus bars surrounding the die attach platform. Multiple I/O pads on an IC chip mounted on the die attach platform req ...


40
Ming Yin Hao, Robert Bertram Ogle Jr, Derick Wristers: Ultrathin oxynitride structure and process for VLSI applications. Advanced Micro Devices, Gerald M Fisher, August 17, 1999: US05939763 (110 worldwide citation)

A process for growing an ultra-thin dielectric layer for use as a MOSFET gate oxide or a tunnel oxide for EEPROM's is described. A silicon oxynitride layer, with peaks in nitrogen concentration at the wafer-oxynitride interface and at the oxynitride surface and with low nitrogen concentration in the ...



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