31
James V Donadio III: Method for manufacturing a tubular medical device. Intratherapeutics, Merchant & Gould P C, February 22, 2000: US06027863 (142 worldwide citation)

Manufacturing processes for apparatus, including slotted hypotube, for use as a catheter, a guidewire, a catheter sheath for use with catheter introducers or a drug infusion catheter/guidewire are disclosed. The manufacturing process includes creating a pattern of slots or apertures in a flexible me ...


32
Todd R Witkowski, Kurt A Dykema, Steven L Geerlings, Mark L Zeinstra: Wireless communications systems and method. Johnson Controls Technology Company, Foley & Lardner, August 14, 2007: US07257426 (137 worldwide citation)

A wireless communications system and method adapted for use in automotive applications for enabling automatic, high-speed, wireless voice and/or data communications link to be established between a wide variety of external devices and various electronic subsystems of a vehicle. The apparatus include ...


33
Bernard Warszawski: Material for light modulation and manufacturing processes. Alpine Polyvision, Mason Fenwick & Lawrence, October 15, 1991: US05056899 (136 worldwide citation)

An electrolytic material intended for a process relating to a light-modulating cell involving electrochromic reflection or transmission. The electrolytic material is a homogeneous mixture of solid consistency, comprising at least (a) a water-soluble salt or salts of one metal which can be cathodical ...


34
Kevin D Stoddard, Bradley D Schulze, Konstantinos Tsakalis: Run-to-run controller for use in microelectronic fabrication. Brooks Automation, Perman & Green, July 1, 2003: US06587744 (129 worldwide citation)

A automated run-to-run controller for controlling manufacturing processes comprises set of processing tools, a set of metrology tools for taking metrology measurements from the processing tools, and a supervising station for managing and controlling the processing tools. The supervising station comp ...


35
Francois J Henley, Nathan W Cheung: Silicon-on-silicon hybrid wafer assembly. Silicon Genesis Corporation, Townsend and Townsend and Crew, April 11, 2000: US06048411 (126 worldwide citation)

A hybrid silicon-on-silicon substrate. A thin film (2101) of single-crystal silicon is bonded to a target wafer (46). A high-quality bond is formed between the thin film and the target wafer during a high-temperature annealing process. It is believed that the high-temperature annealing process forms ...


36
Timothy A Fayram: Capacitor for an implantable cardiac defibrillator. Ventritex, Steven M Mitchell, Mark J Meltzer, June 4, 1996: US05522851 (123 worldwide citation)

A capacitor having a housing defining a chamber, and having at least two internal alignment elements in the chamber. A plurality of capacitor layers, each having alignment holes formed therein to precisely fit the housing's alignment elements, is positioned within the chamber, with the alignment hol ...


37
Douglas S Steele, Larry C Howington, James W Schuler, Joseph J Sostarich, Charles R Wojciechowski, Theodore W Sippel, Joseph M Portaz, Ralph G Isaacs, Henry J Scudder III, Thomas G Kincaid, Kristina H V Hedengren, Rudolph A A Koegl, John P Keaveney, Joseph Czechowski III, John R Brehm, James M Brown Jr, David W Oliver, George E Williams, Richard D Miller: X-ray inspection system. General Electric Company, Derek P Lawrence, Nathan D Herkamp, February 7, 1989: US04803639 (121 worldwide citation)

An X-ray inspection system for manually or automatically performing digital fluoroscopy inspections and/or computed tomography inspections by X-ray examination of manufactured parts incorporates a computer system which automatically analyzes the inspected parts for flaws. The system includes apparat ...


38
Shahram Mostafazadeh, Joseph O Smith: Lead frame design for increased chip pinout. National Semiconductor Corporation, Edward C Kwok, Skjerven Morrill Macpherson Franklin & Friel, March 7, 2000: US06034423 (119 worldwide citation)

An integrated circuit (IC) module incorporates a modified lead frame having a die attach platform, a plurality of leads extending away from the die attach platform, and a plurality of bus bars surrounding the die attach platform. Multiple I/O pads on an IC chip mounted on the die attach platform req ...


39
Tsu Jae King, Victor Moroz: Methods of designing an integrated circuit on corrugated substrate. Synopsys, Bever Hoffman & Harms, Jeanette S Harms, June 14, 2011: US07960232 (117 worldwide citation)

By forming MOSFETs on a substrate having pre-existing ridges of semiconductor material (i.e., a “corrugated substrate”), the resolution limitations associated with conventional semiconductor manufacturing processes can be overcome, and high-performance, low-power transistors can be reliably and repe ...


40
Sammy Mok, Fu Chiung Chong, Frank John Swiatowiec, Syamal Kumar Lahiri, Joseph Michael Haemer: Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs. NanoNexus, Michael A Glenn, Glenn Patent Group, July 12, 2005: US06917525 (117 worldwide citation)

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semicondu ...