Belgacem Haba Belgacem (Bel) Haba
Craig S Mitchell, Belgacem Haba: Micro lead frame packages and methods of manufacturing the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 18, 2007: US07309910 (1 worldwide citation)

A microelectronic package includes a microelectronic element having contacts, a dielectric element, at least a portion of the dielectric element extending beneath the microelectronic element, and a structure including portions of a lead frame. The structure includes a plurality of terminals and lead ...

Dr. Elke Erben
Andreas Spitzer, Elke Erben: Method of manufacturing a dielectric layer and corresponding semiconductor device. Qimonds, Eschweiler & Associates, May 12, 2009: US07531405 (1 worldwide citation)

A polycrystalline dielectric layer is formed wherein the dielectric layer comprises a first dielectric material containing an oxide or nitride and a second material contributing to less than 1% in weight to the dielectric layer, forming a non-conductive oxide or nitride having an enthalpy lower than ...

Eb Eshun
Timothy J Dalton, Ebenezer E Eshun, Sarah L Grunow, Zhong Xiang He, Anthony K Stamper: Interconnect structures and design structures for a radiofrequency integrated circuit. International Business Machines Corporation, Wood Herron & Evans, Anthony J Canale, July 29, 2014: US08791545 (1 worldwide citation)

Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing ...

Erwin Meinders
Maria Peter, Erwin Rinaldo Meinders: Method for forming a multi-level surface on a substrate with areas of different wettability and a semiconductor device having the same. Nederlandse Organisatie voor toegepast—natuurwetenschappelijk onderzoek TNO, Waddey & Patterson P C, James R Cartiglia, November 25, 2014: US08895438 (1 worldwide citation)

The invention relates to a method 10 for forming a multi-level surface on a substrate 2, wherein said surface comprises areas of different wettability, the method comprising the step (A, B) of applying a multi-level stamp to the substrate for forming the multi-level surface, said multi-level stamp h ...

Shankar M V
Venugopal Shankar Madras, Srivastava Alok M, Comanzo Holly Ann, Midha Vikas, Beers William Winder, Ramachandran Gopi Chandran, Adyam Mukunda Srinivas: Electron emissive materials for electric lamps and methods of manufacture thereof. Gen Electric, December 29, 2004: EP1492144-A2 (1 worldwide citation)

An electron emissive composition comprises a barium tantalate composition of the formula (Ba 1-x , Ca x , Sr p , D q ) 6 (Ta 1-y , W y , E t , F u , G v , Ca w ) 2 O (11 +- ') where ' is an amount of about 0 to about -3; and wherein D is either an alkali earth metal ion or an alkaline earth ion; E, ...

Charles Szmanda
Brian P McDavitt, Charles R Szmanda, James R Shelnut: Manufacturing process billing system. Shipley Company L L C, Marisa J Dubuc, S Matthew Cairns, July 18, 2006: US07079910 (1 worldwide citation)

A method and system is provided for improving the efficiency of a process for manufacturing a product and begins with the step of receiving from a manufacturer a desire to manufacture a number of said products. Next, the amount of materials that is required to produce the number of products is deter ...

Erwin Meinders
MEINDERS ERWIN RINALDO, FLEDDERUS HENRI, PRENEN AN MARIA: [fr] Feuille donneuse et procédé de fabrication de transfert avant induit par la lumière, [de] Donatorfolie und Verfahren zur lichtinduzierten Vorwärtsübertragungsherstellung, [en] Donor sheet and method for light induced forward transfer manufacturing. TNO, IMEC, November 6, 2013: EP2660352-A1 (1 worldwide citation)

[en] A light induced forward transfer manufacturing method provides for transfer of material from a donor sheet (14). A donor sheet is used that comprises a trench in a surface of the donor sheet, with transfer material in the trench. The material is transferred by scanning a light spot along the bo ...

Isaiah Oladeji
Isaiah O Oladeji, Scott Jessen, Joseph Ashley Taylor: Mask layer and interconnect structure for dual damascene semiconductor manufacturing. Beusse Brownlee Bowdoin & Wolter P A, April 3, 2003: US20030064582-A1 (1 worldwide citation)

A novel mask layer is used in the dual damascene construction of an interconnect structure of an integrated circuit device. The interconnect structure has a low-k dielectric material. The mask layer has a passivation film deposited on the low-k dielectric material, a barrier film is deposited over t ...

Erwin Meinders
Meinders Erwin R: Replication of a high-density relief structure. Koninklijke Philips Electronics, Meinders Erwin R, UITTENBOGAARD Frank, March 16, 2006: WO/2006/027732 (1 worldwide citation)

The invention relates to a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1), to such a reverse mold (2, 4) and to a method for replicating of such a high-density relief structure (1). To provide an improved and reliable method for the best possible r ...

Erwin Meinders
Meinders Erwin R, Neijzen Jacobus H M: Record carrier with improved modulation and asymmetry. Koninklijke Philips Electronics, Meinders Erwin R, Neijzen Jacobus H M, UITTENBOGAARD Frank, December 15, 2005: WO/2005/119661 (1 worldwide citation)

The invention relates to a record carrier comprising a train of marks and lands (14, 15, 23), which has a plurality of marks comprising shortest marks (1) and other marks (2) and a plurality of lands between said marks in a direction of said train of marks and lands comprising shortest lands (28) an ...