Eb Eshun
Timothy J Dalton, Ebenezer E Eshun, Sarah L Grunow, Zhong Xiang He, Anthony K Stamper: Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit. International Business Machines Corporation, Wood Herron & Evans, Anthony J Canale, October 30, 2012: US08298902 (1 worldwide citation)

Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing ...

Shankar M V
Venugopal Shankar Madras, Srivastava Alok M, Comanzo Holly Ann, Midha Vikas, Beers William Winder, Ramachandran Gopi Chandran, Adyam Mukunda Srinivas: Electron emissive materials for electric lamps and methods of manufacture thereof. Gen Electric, December 29, 2004: EP1492144-A2 (1 worldwide citation)

An electron emissive composition comprises a barium tantalate composition of the formula (Ba 1-x , Ca x , Sr p , D q ) 6 (Ta 1-y , W y , E t , F u , G v , Ca w ) 2 O (11 +- ') where ' is an amount of about 0 to about -3; and wherein D is either an alkali earth metal ion or an alkaline earth ion; E, ...

Charles Szmanda
Brian P McDavitt, Charles R Szmanda, James R Shelnut: Manufacturing process billing system. Shipley Company L L C, Marisa J Dubuc, S Matthew Cairns, July 18, 2006: US07079910 (1 worldwide citation)

A method and system is provided for improving the efficiency of a process for manufacturing a product and begins with the step of receiving from a manufacturer a desire to manufacture a number of said products. Next, the amount of materials that is required to produce the number of products is deter ...

Isaiah Oladeji
Isaiah O Oladeji, Scott Jessen, Joseph Ashley Taylor: Mask layer and interconnect structure for dual damascene semiconductor manufacturing. Beusse Brownlee Bowdoin & Wolter P A, April 3, 2003: US20030064582-A1 (1 worldwide citation)

A novel mask layer is used in the dual damascene construction of an interconnect structure of an integrated circuit device. The interconnect structure has a low-k dielectric material. The mask layer has a passivation film deposited on the low-k dielectric material, a barrier film is deposited over t ...

Erwin Meinders
Meinders Erwin R: Replication of a high-density relief structure. Koninklijke Philips Electronics, Meinders Erwin R, UITTENBOGAARD Frank, March 16, 2006: WO/2006/027732 (1 worldwide citation)

The invention relates to a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1), to such a reverse mold (2, 4) and to a method for replicating of such a high-density relief structure (1). To provide an improved and reliable method for the best possible r ...

Erwin Meinders
Meinders Erwin R, Neijzen Jacobus H M: Record carrier with improved modulation and asymmetry. Koninklijke Philips Electronics, Meinders Erwin R, Neijzen Jacobus H M, UITTENBOGAARD Frank, December 15, 2005: WO/2005/119661 (1 worldwide citation)

The invention relates to a record carrier comprising a train of marks and lands (14, 15, 23), which has a plurality of marks comprising shortest marks (1) and other marks (2) and a plurality of lands between said marks in a direction of said train of marks and lands comprising shortest lands (28) an ...

Erwin Meinders
Meinders Erwin Rinaldo, Peter Maria, Giesen Peter Theodorus Maria, de Laat Wilhelmus Johannes Maria: A system for patterning flexible foils. Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek Tno, Meinders Erwin Rinaldo, Peter Maria, Giesen Peter Theodorus Maria, de Laat Wilhelmus Johannes Maria, HATZMANN MJ, September 3, 2009: WO/2009/108054 (1 worldwide citation)

According to one aspect, the invention provides a table (1) for compensating deformation in flexible foils. The table (1) comprises a supportive base (2) and a deformation compensation system (3). This system comprises a plurality of movable elements (4), supported by the base (2), wherein the movab ...

Ivo Koutsaroff 掘露 伊保龍
Ivoyl P Koutsaroff, Mark Vandermeulen, Andrew Cervin Lawry, Atin J Patel: Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same. BlackBerry, Guntin & Gust, Andrew Gust, October 29, 2013: US08569142

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, ...

Belgacem Haba Belgacem (Bel) Haba
Craig S Mitchell, Belgacem Haba: Micro lead frame packages and methods of manufacturing the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 10, 2007: US07202112

A method of making a microelectronic package includes providing a lead frame having at least one bus element and a plurality of branches extending from the bus element, each branch including a terminal and an elongated lead extending between the bus element and the terminal. The method includes appl ...

Dr. Elke Erben
Andreas Spitzer, Elke Erben: Method of manufacturing a dielectric layer and corresponding semiconductor device. Qimonds, Eschweiler & Associates, May 12, 2009: US07531405

A polycrystalline dielectric layer is formed wherein the dielectric layer comprises a first dielectric material containing an oxide or nitride and a second material contributing to less than 1% in weight to the dielectric layer, forming a non-conductive oxide or nitride having an enthalpy lower than ...

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