31
David Sherrer
David W Sherrer: V-groove chip with wick-stop trench for improved fiber positioning. ACT MicroDevices, Dan Steinberg, April 10, 2001: US06215946 (8 worldwide citation)

A V-groove chip for fiber arrays having a wick stop trench. The wick stop trench intersects the V-grooves and is deeper than the V-grooves. The wick stop trench prevents adhesive from moving via capillary action along the entire length of a V-groove. This is very useful for manufacturing V-groove fi ...


32
Ulrich Klostermann
Manfred Ruehrig, Ulrich Klostermann, Michael Vieth: Integrated circuit, memory module, and method of manufacturing an integrated circuit. Qimonda, John S Economou, February 22, 2011: US07893511 (7 worldwide citation)

An integrated circuit includes a plurality of magnetic tunneling junction stacks, each magnetic tunneling junction stack including a reference layer, a barrier layer and a free layer, wherein the plurality of magnetic tunneling junction stacks share a continuous common reference layer.


33
David Sherrer
David W Sherrer, James C Hurst Jr: Fiber array with wick-stop trench for improved fiber positioning. Haleos, D Steinberg, Martin Meder, March 26, 2002: US06363201 (7 worldwide citation)

A V-groove chip for fiber arrays having a wick stop trench. The wick stop trench intersects the V-grooves and is preferably deeper than the V-grooves. The wick stop trench prevents adhesive from moving via capillary action along the entire length of a V-groove. This is very useful for manufacturing ...


34
Craig Allen
Craig Allen McEldowney, Mark Richard Mitchell: Tab with coin precurl for improved curl formation. Stolle Machinery Company, Eckert Seamans Cherin & Mellot, Grant E Coffield Esq, November 10, 2009: US07614520 (6 worldwide citation)

A tab is used to open beer/beverage can ends and food can ends. The tab has one or more arcuate strips that are provided on a surface of the tab proximate to a peripheral surface of the tab where the one or more arcuate strips have been formed further into a preselected portion of curled or hemmed p ...


35
Shankar M V
Shankar Madras Venugopal, Alok M Srivastava, Holly Ann Comanzo, Vikas Midha, William Winder Beers, Gopi Chandran Ramachandran, Mukunda Srinivas Adyam: Composite electrode materials for electric lamps and methods of manufacture thereof. General Electric Company, Fletcher Yoder, April 12, 2005: US06879091 (6 worldwide citation)

An electron emissive composition comprises a barium tantalate composition in an amount of about 50 to about 95 wt %; and a ferroelectric oxide composition in an amount of about 5 to about 50 wt %, wherein the weight percents are based on the total weight of the barium tantalate composition and the f ...


36
Craig Allen
Craig Allen Carnes, Robert Francis Pitman: Grooved, corner-ready wall base. Burke, Law Offices of James R Cypher, Charles R Cypher, March 29, 2011: US07914878 (4 worldwide citation)

A resilient wall base member manufactured with pre-scored grooves to allow relatively short, straight lengths to be used for both flat walls and wall corner junctures without on site scoring operations or equipment. The lengths can either be pre-cut during manufacturing to convenient lengths or can ...


37
Katherina Babich
Deok kee Kim, Kenneth T Settlemyer Jr, Kangguo Cheng, Ramachandra Divakaruni, Carl J Radens, Dirk Pfeiffer, Timothy Dalton, Katherina Babich, Arpan P Mahorowala, Harald Okorn Schmidt: Methods and structures for protecting one area while processing another area on a chip. International Business Machines Corporation, Whitman Curtis Christofferson & Cook PC, Joseph P Abate, March 3, 2009: US07497959 (4 worldwide citation)

Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided whi ...


38
Jean-luc Dubois
Jean Luc Dubois: Process for manufacturing acrolein from glycerol. Arkema France, Lynn B Morreale, February 19, 2013: US08378136 (4 worldwide citation)

The subject of the present invention is a process for preparing acrolein by dehydration of glycerol in the presence of a catalyst system comprising oxygen, phosphorus and at least one metal chosen from vanadium, boron or aluminium. The process is preferably carried out in the gas phase in the presen ...


39
David Bohling
Eric Anthony Robertson III, David Arthur Bohling, Mark Allen George, Scott Edward Beck: Gas phase removal of SiO.sub.2 /metals from silicon. Air Products and Chemicals, Geoffrey L Chase, December 12, 2000: US06159859 (4 worldwide citation)

The present invention is a process for thermal, vapor phase removal of silicon oxides and metal-containing contaminants from a surface of a substrate of a type used in manufacturing semiconductor devices comprising contacting the substrate at an elevated temperature at an elevated temperature approp ...


40
Deodatta Shenai-Khatkhate
Deodatta Vinayak Shenai Khatkhate, Egbert Woelk: Organometallic compounds. Rohm and Haas Electronic Materials, S Matthew Cairns, June 24, 2008: US07390360 (4 worldwide citation)

Compositions useful in the manufacture of compound semiconductors are provided. Methods of manufacturing compound semiconductors using these compositions are also provided.