21
Jean-luc Dubois
Jean Luc Dubois, Christophe Duquenne, Wolfgang Holderich: Process for dehydrating glycerol to acrolein. Arkema France, Steven D Boyd, July 8, 2008: US07396962 (25 worldwide citation)

The present invention relates to a process for manufacturing acrolein by dehydration of glycerol in the presence of molecular oxygen. The reaction is performed in the liquid phase or in the gas phase in the presence of a solid catalyst. The addition of oxygen makes it possible to obtain good glycero ...


22
Belgacem Haba Belgacem (Bel) Haba
Joseph C Fjelstad, Belgacem Haba: Multi-path via interconnection structures and methods for manufacturing the same. Silicon Pipe, Shemwell Gregory & Courtney, May 10, 2005: US06891272 (24 worldwide citation)

A multilayered circuit component includes one or more substrates. A first surface of one of the substrates includes circuit paths and other current carrying elements. A second surface of the same or another substrate also includes circuit paths and other current carrying elements. An aperture extend ...


23
Ulrich Klostermann
Stephen L Brown, Arunava Gupta, Ulrich Klostermann, Stuart Stephen Papworth Parkin, Wolfgang Raberg, Mahesh Samant: Magnetic tunnel junctions for MRAM devices. Infineon Technologies, International Business Machines Corporation, Slater & Matsil L, December 12, 2006: US07149105 (19 worldwide citation)

Methods of manufacturing MTJ memory cells and structures thereof. A diffusion barrier is disposed between an anti-ferromagnetic layer and a pinned layer of an MTJ memory cell to improve thermal stability of the MTJ memory cell. The diffusion barrier may comprise an amorphous material or a NiFe alloy ...


24
Ivo Koutsaroff 掘露 伊保龍
Ivoyl P Koutsaroff, Mark Vandermeulen, Andrew Cervin Lawry, Atin J Patel: Multi-level thin film capacitor on a ceramic substrate. Gennum Corporation, Jones Day, May 29, 2007: US07224040 (18 worldwide citation)

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, ...


25
Erwin Meinders
Martijn Henri Richard Lankhorst, Franciscus Petrus Widdershoven, Robertus Adrianus Maria Wolters, Wilhelmus Sebastianus Marcus Maria Ketelaars, Erwin Rinaldo Meinders: Electric device with phase change material and method of manufacturing the same. Koninklijke Phillips Electronics, Peter Zawilski, October 10, 2006: US07119353 (18 worldwide citation)

The electric device (100) has a body (102) having a resistor (107) comprising a phase change material being changeable between a first phase and a second phase. The resistor (107) has a first electrical resistance when the phase change material is in the first phase, and a second electrical resistan ...


26
Craig Allen
Desaraju V Varaprasad, Mingtang Zhao, Craig Allen Dornan, Anoop Agrawal, Pierre Marc Allemand, Niall R Lynam: Electrochromic polymeric solid films, manufacturing electrochromic devices using such sold films, and processes for making such solid films and devices. Donnelly Corporation, Fitzpatrick Cella Harper & Scinto, October 11, 2005: US06954300 (14 worldwide citation)

The present invention relates to electrochromic polymeric solid films, manufacturing electrochromic devices using such solid films and processes for making such solid films and devices. The electrochromic polymeric solid films of the present invention exhibit beneficial properties and characteristic ...


27
Ulrich Klostermann
Ulrich Klostermann, Rainer Leuschner: Integrated circuit, method of manufacturing an integrated circuit, and memory module. Qimonda, Altis Semiconductor SNC, December 21, 2010: US07855435 (14 worldwide citation)

According to one embodiment of the present invention, an integrated circuit including a plurality of memory cells is provided. Each memory cell includes a resistivity changing memory element which includes a top electrode, a bottom electrode, and resistivity changing material being disposed between ...


28
Jean-luc Dubois
Jean Luc Dubois, Christophe Duquenne, Wolfgang Holderich, Jacques Kervennal: Process for dehydrating glycerol to acrolein. Arkema France, Steven D Boyd, February 2, 2010: US07655818 (12 worldwide citation)

The present invention relates to a process for manufacturing acrolein by gas-phase dehydration of glycerol in the presence of strongly acidic solid catalysts with a Hammett acidity H0 of between −9 and −18 and preferably between −10 and −16.


29
Ulrich Klostermann
Human Park, Ulrich Klostermann, Rainer Leuschner: Condensed memory cell structure using a FinFET. Qimonda, Altis Semiconductor SNC, John S Economou, March 4, 2014: US08665629 (11 worldwide citation)

An integrated circuit and method for manufacturing an integrated circuit are described. In one embodiment, the integrated circuit includes a memory cell that includes a resistivity changing memory element. The resistivity changing memory element is electrically coupled to a select transistor that in ...


30
Craig Allen
Craig Allen McEldowney, Mark Richard Mitchell: Tab, tooling for the manufacture of the tab and method of manufacturing the tab. Stolle Machinery Company, Eckert Seamans Cherin & Mellott, Grant E Coffield Esquire, March 16, 2010: US07677404 (9 worldwide citation)

The invention generally relates to a tab used to open food can ends and beer/beverage can ends. The tab has a nose portion located at a front end of the tab and a lift portion located at a back end of the tab. The tab also has a rivet receiving portion located proximate to the nose portion with a ri ...