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Shafidul Islam, Romarico Santos San Antonio, Anang Subagio: Lead frame routed chip pads for semiconductor packages. Unisem, Wiggin and Dana, September 14, 2010: US07795710 (9 worldwide citation)

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by ...


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Shafidul Islam, Romarico Santos San Antonio, Anang Subagio: Lead frame routed chip pads for semiconductor packages. Unisem, Wiggin and Dana, October 26, 2010: US07820480 (5 worldwide citation)

A redistributed lead frame for use in a molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated b ...


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Islam Shafidul, Santos San, Antonio Romarico, Subagio Anang: Lead frame routed chip pads for semiconductor packages. Advanced Interconnect Technologies, Islam Shafidul, Santos San, Antonio Romarico, Subagio Anang, ROSENBLATT Gregory S, January 13, 2005: WO/2005/004200 (1 worldwide citation)

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by ...


4
Romarico Santos San Antonio, Anang Subagio, Shafidul Islam: Lead frame routed chip pads for semiconductor packages. Unisem, Wiggin and Dana, November 6, 2012: US08304864

A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first mol ...


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Islam Shafidul, Santos San Antonio Romarico, Subagio Anang: Lead frame routed chip pads for semiconductor packages. Advanced Interconnect Tech, May 3, 2006: EP1652227-A2

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by ...


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Shafidul Islam, Romarico Santos San Antonio, Anang Subagio: Lead frame routed chip pads for semiconductor packages. Wiggin And Dana, March 27, 2008: US20080076206-A1

A redistributed lead frame for use in a molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated b ...


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Shafidul Islam, Romarico Santos, Anang Subagio: Lead frame routed chip pads for semiconductor packages. Wiggin And Dana, July 13, 2006: US20060151860-A1

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by ...


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Romarico Santos San Antonio, Anang Subagio, Shafidul Islam: Lead frame routed chip pads for semiconductor packages. Wiggin And Dana, January 6, 2011: US20110001224-A1

A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first mol ...


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Islam Shafidul, Santos Romarico, Subagio Anang: Lead frame routed chip pads for semiconductor packages. Advanced Interconnect Technolo, jiang shixun, September 20, 2006: CN200480017737

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by ...


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