1
Tim J Corbett: Laser marking techniques. Micron Technology, Trask Britt & Rossa, November 16, 1999: US05985377 (47 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes ...


2
Tim J Corbett: Laser marking techniques. Micron Technology, Trask Britt, August 22, 2000: US06108026 (16 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy is present. The heat associated with the laser beam causes ...


3
Tim J Corbett: Laser marking techniques. Micron Technology, Trask Britt & Rossa, November 17, 1998: US05838361 (15 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy is present. The heat associated with the laser beam causes ...


4
Tim J Corbett: Laser marking techniques. Micron Technology, Trask Britt, April 17, 2001: US06217949 (9 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes ...


5
Warren M Farnworth, Alan G Wood: Laser marking techniques for bare semiconductor die. Micron Technology, TraskBritt, March 23, 2004: US06710284 (6 worldwide citation)

A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described ...


6
Tim J Corbett: Laser marking techniques. Micron Technology, TraskBritt, October 8, 2002: US06461690 (5 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes ...


7
James Bovatsek, Alan Y Arai, Fumiyo Yoshino: Transparent material processing with an ultrashort pulse laser. IMRA AMERICA, Sughrue Mion PLLC, Richard C Turner, May 2, 2017: US09636773 (4 worldwide citation)

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent ma ...


8
Tim J Corbett: Laser marking techniques. Micron Technology, TraskBritt, August 6, 2002: US06429890 (4 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy is present. The heat associated with the laser beam causes ...


9
Tim J Corbett: Comparing identifying indicia formed using laser marking techniques to an identifying indicia model. Micron Technology, TraskBritt, November 18, 2008: US07452732 (3 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser-reactive marking material, such as a pigment containing epoxy, is present. The heat associated with the laser bea ...


10
Warren M Farnworth: Laser marking techniques for bare semiconductor die. Micron Technology, TraskBritt, January 20, 2004: US06680458 (3 worldwide citation)

A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described ...