1
Dae ho Choo, Byeong ill Kim, Sung uk Jung, Woo shik Lee, Bum soo Kim: Laser cutting apparatus and method. Samsung Electronics, McGuireWoods, June 18, 2002: US06407360 (83 worldwide citation)

A laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at star ...


2
Shoichi Terada, Kazuto Yoshimura, Kenji Masuda, Hidehiro Ito: Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device. Seiko Epson Corporation, Oliff & Berridge, May 13, 2003: US06563082 (36 worldwide citation)

Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a prod ...


3
Dae ho Choo, Byeong ill Kim, Sung uk Jung, Woo shik Lee, Bum soo Kim: Laser cutting apparatus and method. Samsung Electronics, McGuireWoods, April 20, 2004: US06723952 (23 worldwide citation)

The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for f ...


4
Takei Atsushi, Ito Hidehiro: Support table for laser cutting, apparatus and method for laser cutting, and method for producing liquid crystal panel. Seiko Epson, January 8, 2003: JP2003-002677 (5 worldwide citation)

PROBLEM TO BE SOLVED: To provide a new construction capable of preventing or reducing failures due to laser beam scattering when splitting a workpiece by laser cutting.SOLUTION: A laser cutting apparatus 20 comprises a support table 21 made of a rigid body such as metal and a laser irradiation syste ...


5
Laser cutting apparatus and method. Photon Sources, June 30, 1982: GB2090047-A (3 worldwide citation)

An apparatus and method for cutting material from a workpiece uses a laser resonator emitting an essentially coherent beam of electromagnetic radiation having at least partial linear polarization and a converting means converting the linearly polarized laser beam into an essentially coherent beam of ...


6
Frederick N Bushroe, Mohamed H Khan, Craig T Walters: Hand-held laser cutting apparatus and method using same. Climax Molybdenum Company, Dale F Regelman, Quarles & Brady, August 10, 2010: US07772520 (2 worldwide citation)

A hand-held apparatus is disclosed, where that hand-held apparatus comprises a hand piece having an output end, a switch disposed on that hand piece, wherein that switch includes “on” position and an “off” position, and wherein a laser beam is directed outwardly from the output end of the hand piece ...


7
Choo Dae Ho, Kim Byeong Ill, Jung Sung Uk, Lee Woo Shik, Kim Bum Soo: Laser cutting apparatus and method. Samsung Electronics, January 21, 2001: TW419867 (2 worldwide citation)

The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for f ...


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Fredrick William G Jr, Barber Richard B, Ward John F: Appareil pour le decoupage au rayon laser, et methode connexe, Laser cutting apparatus and method. Photon Sources, RIDOUT & MAYBEE, June 25, 1985: CA1189576

ABSTRACT OF THE DISCLOSURE An apparatus and method for cutting materialfrom a workpiece by means of a laser beam. A laserresonator emits an essentially coherentbeam ofelectromagnetic radiation having at least partiallinear polarization. A converting means receives the linearlypolarized laser beam an ...


10
Yahagi Susumu, Ooe Atsushi, Hayashi Masakazu: Laser cutting apparatus and method. Toshiba, heteng yun, July 25, 2007: CN200710002110

The invention providing a laser chopping up apparatus can improve process precision. The apparatus comprises a holding mechanism for holding an object and a processing mechanism for irradiating the object held by the holding mechanism with a laser beam to locally heat/cool the object. The holding me ...