1
Charles W Eichelberger, James E Kohl: Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, November 17, 2009: US07619901 (310 worldwide citation)

Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer i ...


2
Charles W EICHELBERGER, James E KOHL: Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system. Epic Technologies, Heslin Rothenberg Farley & Mesiti PC, December 25, 2008: US20080316714-A1

Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer i ...