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Oswald Skeete, Ravi Mahajan, John Guzek: Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate. Intel Corporation, Schwegman Lundberg & Woessner P A, April 10, 2018: US09941245 (31 worldwide citation)

In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one ...


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Skeete Oswald, Mahajan Ravi, Guzek John: Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate. Intel Corporation, Skeete Oswald, Mahajan Ravi, Guzek John, VINCENT Lester J, April 2, 2009: WO/2009/042463 (1 worldwide citation)

In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one ...


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Oswald Skeete, Ravi Mahajan, John Guzek: Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate. May 5, 2011: US20110101491-A1

In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one ...


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Skeete Oswald, Mahajan Ravi, Guzek John: Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate. Intel, wu shaodun wang yang, August 11, 2010: CN200880106620

In some embodiments, integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate are presented. In this regard, an apparatus is introduced having a first element including a microelectronic die having an active surface and at least one ...