1
Jordi Soler Castany, Jaume Anguera Pros, Carles Puente Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Fractus, Jones Day, August 22, 2006: US07095372 (82 worldwide citation)

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


2
Soler, Castany Jordi, Anguera, Pros Jaume, Puente, Baliarda Carles, Borja, Borau Carmen: Integrated circuit package including miniature antenna. Fractus, Soler, Castany Jordi, Anguera, Pros Jaume, Puente, Baliarda Carles, Borja, Borau Carmen, RICKER Mathias, May 21, 2004: WO/2004/042868 (22 worldwide citation)

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


3
Jordi Soler Castany, Jaume Anguera Pros, Carles Puenta Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Fractus, Kenyon & Kenyon, December 9, 2008: US07463199 (14 worldwide citation)

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


4
Jordi Soler Castany, Jaume Anguera Pros, Carles Puente Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Fractus, Kenyon & Kenyon, June 19, 2012: US08203488 (5 worldwide citation)

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


5
Jordi Soler Castany, Jaume Anguera Pros, Carles Puente Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Fractus, Kenyon & Kenyon, July 7, 2015: US09077073 (2 worldwide citation)

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


6
Jordi Soler Castany, Jaume Anguera Pros, Carles Puente Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Fractus, Edell Shapiro & Finnan, August 21, 2018: US10056691

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


7
Soler Castany Jordi, Anguera Pros Jaume, Puente Baliarda Carles, Borja Borau Carmen: Integrated circuit package including miniature antenna. Fractus, August 17, 2005: EP1563570-A1

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


8
Jordi Soler Castany, Jaume Anguera Pros, Carles Puenta Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Fractus, Howison & Arnott, November 16, 2006: US20060256018-A1

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


9
Jordi Soler Castany, Jaume Anguera Pros, Carles Puente Baliarda, Carmen Borja Borau: Integrated circuit package including miniature antenna. Joseph M Sauer, Jones Day, February 16, 2006: US20060033664-A1

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...


10
Jordi SOLER CASTANY, Jaume ANGUERA PROS, Carles PUENTE BALIARDA, Carmen BORJA BORAU: Integrated circuit package including miniature antenna. Fractus, Kenyon & Kenyon, April 2, 2009: US20090085810-A1

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d ...