1
David Schoenthaler: Integrated circuit interconnection technique. AT&T Bell Laboratories, Robert B Levy, November 10, 1992: US05162613 (31 worldwide citation)

Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive ma ...


2
Schoenthaler David: Integrated circuit interconnection technique.. American Telephone & Telegraph, January 7, 1993: EP0521672-A1 (1 worldwide citation)

Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive ma ...