1
Jin Yuan Lee, Mou Shiung Lin, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. MEGICA Corporation, Winston Hsu, August 19, 2008: US07413929 (44 worldwide citation)

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


2
Mou Shiung Lin, Jin Yuan Lee, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. Megica Corporation, McDermott Will & Emery, March 1, 2011: US07898058 (6 worldwide citation)

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


3
Mou Shiung Lin, Jin Yuan Lee, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. Megica Corporation, Seyfarth Shaw, June 25, 2013: US08471361 (3 worldwide citation)

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


4
Jin Yuan Lee, Mou Shiung Lin, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. JC Patents, June 24, 2004: US20040119097-A1

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


5
Jin Yuan Lee, Mou Shiung Lin, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. JC Patents, September 2, 2004: US20040169264-A1

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


6
Jin Yuan Lee, Mou Shiung Lin, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. JC Patent, July 3, 2003: US20030122243-A1

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


7
Jin Yuan Lee, Mou Shiung Lin, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. Megica Corporation, Mou Shiung Lin, October 30, 2008: US20080265401-A1

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...


8
Jin Yuan Lee, Mou Shiung Lin, Ching Cheng Huang: Integrated chip package structure using organic substrate and method of manufacturing the same. Megica Corporation, August 25, 2011: US20110205720-A1

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to ...