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John Impey: Injection molded multi-layer circuit board and method of making same. Rollin Mettler, John Mettler, John Impey, DeLio & Associates, May 27, 1986: US04591220 (29 worldwide citation)

A multi-layer circuit board comprised of two or more circuit board substrates shaped by injection molding with mating interconnecting pins and holes and banded together with an electrically insulating adhesive material. Circuit leads are provided on both sides of each substrate recessed into channel ...


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Impey John: Carte multicouche moulee par injection, pour circuit imprime, et sa fabrication, Injection molded multi-layer circuit board and method of making same. Mint Pac Technologies, OGILVY RENAULT SENCRLSRL, November 3, 1987: CA1228932

Abstract A multi-layer circuit board comprised of two or morecircuit board substrates shaped by injection moldingwith mating interconnecting pins and holes and bandedtogether with an electrically insulated adhesivematerial. Circuit leads are provided on both sides ofeach substrate recessed into chan ...


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Impey John: Injection molded multi-layer circuit board and method of making same. Impey John, Mettler Rollin W Jr, Mettler John H, DeLIO Anthony P, April 24, 1986: WO/1986/002518

A multi-layer circuit board comprised of two or more circuit board substrates (10, 12) shaped by injection molding with mating interconnecting pins (22) and holes (24) and banded together with an electrically insulated adhesive material (28). Circuit leads (14, 16, 18, 20) are provided on both sides ...