1
James Rathburn: High performance surface mount electrical interconnect with external biased normal force loading. HSIO TECHNOLOGIES, Stoel Rives, November 24, 2015: US09196980 (5 worldwide citation)

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality o ...


2
James Rathburn: Direct metalization of electrical circuit structures. HSIO Technologies, March 21, 2017: US09603249

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is plated on surfaces of a plurality ...


3
James Rathburn: High performance surface mount electrical interconnect with external biased normal force loading. Hsio Technologies, September 27, 2012: US20120244728-A1

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality o ...