1
Rathburn James: High performance surface mount electrical interconnect. HSIO TECHNOLOGIES, Schwappach Karl G, December 2, 2010: WO/2010/138493 (44 worldwide citation)

An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second sur ...


2
RATHBURN James: INTERCONNEXION ÉLECTRIQUE POUR MONTAGE EN SURFACE DE HAUTE PERFORMANCE, HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT. HSIO TECHNOLOGIES, RATHBURN James, SCHWAPPACH Karl G, June 7, 2012: WO/2012/074963 (44 worldwide citation)

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the ...


3
James Rathburn: High performance surface mount electrical interconnect. Hsio Technologies, Stoel Rives, February 17, 2015: US08955215 (29 worldwide citation)

A method of forming an interconnect assembly including forming a substrate with a plurality of through holes extending from a first major surface to a second major surface. A plurality of recesses are formed in the second major surface of the substrate that at least partially overlap with the plural ...


4
James Rathburn: High performance surface mount electrical interconnect with external biased normal force loading. HSIO TECHNOLOGIES, Stoel Rives, November 24, 2015: US09196980 (5 worldwide citation)

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality o ...


5
James Rathburn: High performance surface mount electrical interconnect. HSIO TECHNOLOGIES, Stoel Rives, July 28, 2015: US09093767 (4 worldwide citation)

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the ...


6
James Rathburn: Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection. HSIO Technologies, April 4, 2017: US09613841 (1 worldwide citation)

An area array integrated circuit (IC) package for an IC device. The IC package includes a first substrate with conductive traces electrically coupled to the IC device. An interconnect assembly having a first surface is mechanically coupled to the first substrate. The interconnect assembly includes a ...


7
James Rathburn: High performance surface mount electrical interconnect. HSIO Technologies, May 23, 2017: US09660368 (1 worldwide citation)

An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second sur ...


8
James Rathburn: Semiconductor socket with direct selective metalization. HSIO Technologies, January 3, 2017: US09536815

A semiconductor socket including a substrate with a plurality of through holes extending from a first surface to a second surface. A conductive structure is disposed within the through holes A plurality of discrete contact members are located in the plurality of the through holes, within the conduct ...


9
James Rathburn: Direct metalization of electrical circuit structures. HSIO Technologies, March 21, 2017: US09603249

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is plated on surfaces of a plurality ...


10
James Rathburn: High performance surface mount electrical interconnect. Hsio Technologies, March 8, 2012: US20120055701-A1

An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second sur ...