1
Hsin Hung Lin, Shih Cheng Wu, Wei Cheng Ku, Chien Liang Chen, Ming Chi Chen, Hendra Sudin: Vertical type high frequency probe card. MJC Probe Incorporation, Bacon & Thomas PLLC, May 6, 2008: US07368928 (6 worldwide citation)

A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, w ...


2
Wei Cheng Ku, Hsin Hung Lin, Chih Hao Ho, Te Chen Feng: High-frequency probe card and transmission line for high-frequency probe card. MPI Corporation, Browdy and Neimark PLLC, March 23, 2010: US07683645 (5 worldwide citation)

A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. Hig ...


3
Sheu Chia Chang: High frequency cantilever probe card. Sv Probe Taiwan, March 11, 2005: TWM259164 (3 worldwide citation)

The present invention provides a high frequency probe card applied in semiconductor wafer test. It comprises a printed circuit board, a plurality of probe needles, a probe fixture unit and a plurality of shielding layers, wherein the interleaved arrangement of the shielding layers between the probe ...


4
Chia Tai Chang, Chin Yi Tsai, Chiu Kuei Chen, Chen Chih Yu, Chien Chang Lai, Chin Tien Yang, Hui Pin Yang, Keng Shieng Chang, Yun Ru Huang: High frequency probe card. MPI CORPORATION, Muncy Geissler Olds & Lowe P C, December 1, 2015: US09201098 (1 worldwide citation)

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and hav ...


5
Chia Tai Chang, Hui Pin Yang: High frequency probe card for probing photoelectric device. MPI CORPORATION, Muncy Geissler Olds & Lowe P C, January 3, 2017: US09535093

A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing ...


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Wei Cheng Ku, Hsin Hung Lin, Chih Hao Ho, Te Chen Feng: High-frequency probe card and transmission line for high-frequency probe card. MJC Probe Incorporation, Browdy And Neimark Pllc, January 10, 2008: US20080007278-A1

A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. Hig ...


9
Hsin Hung Lin, Shih Cheng Wu, Wei Cheng Ku, Chien Liang Chen, Ming Chi Chen, Hendra Sudin: Vertical type high frequency probe card. Mjc Probe Incorporation, Bacon & Thomas Pllc, March 6, 2008: US20080054918-A1

A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, w ...


10
Huppenthal Jon: Functional at speed test system for integrated circuits on undiced wafers. Cray Computer Corporation, CRANDELL Ralph F, March 19, 1992: WO/1992/004637

A digital test system for functionally testing undiced, diced, and packaged ICs on wafers at relatively high test frequencies. The primary components of the system (20) include an interface assembly (22); a high frequency probe card assembly (24); a test signal generator (26) for generating input si ...