1
Tiong C Go: High-density electronic modules--process and product. Irvine Sensors Corporation, Thomas J Plante, November 10, 1987: US04706166 (252 worldwide citation)

A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all t ...


2
Tiong C Go: High-density electronic modules - process and product. Irvine Sensors Corporation, Thomas J Plante, January 8, 1991: US04983533 (218 worldwide citation)

A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all t ...


3
Go Tiong C: High-density electronic modules, process and product.. Irvine Sensors, September 12, 1990: EP0385979-A1

A high-density electronic module (24) is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips (22), each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so ...


4
Go Tiong C: High-density electronic modules, process and product. Irvine Sensors Corporation, PLANTE Thomas J, May 5, 1989: WO/1989/004113

A high-density electronic module (24) is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips (22), each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so ...