1
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, November 29, 2005: US06970644 (25 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


2
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, September 11, 2007: US07269343 (17 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


3
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Dority & Manning P A, May 24, 2011: US07949237 (7 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


4
Koren Zion, O Carroll Conor Patrick, Timans Paul Janis Dr, Choy Shuen Chun, Cardena Rudy Santo Tomas: Heating configuration for use in thermal processing chambers. Mattson Thermal Products, June 21, 2003: TW538480 (2 worldwide citation)

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


5
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardena, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Mattson Technology, Timothy A Cassidy, Dority & Manning Pa, January 29, 2004: US20040018008-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


6
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating Configuration for Use in Thermal Processing Chambers. Dority & Manning Pa, December 27, 2007: US20070297775-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


7
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating configuration for use in thermal processing chambers. Dority & Manning Pa, September 29, 2005: US20050213949-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


8
Zion Koren, Conor Patrick O Carroll, Shuen Chun Choy, Paul Janis Timans, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Arieh A Strod: Heating Configuration For Use in Thermal Processing Chambers. September 15, 2011: US20110222840-A1

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


9
Koren Zion, O, Carroll Conor Patrick, Timans Paul Janis, Choy Shuen Chun, Cardena Rudy Santo Tomas, Taoka James Tsuneo, Strod Arieh A: Heating configuration for use in thermal processing chambers. Mattson Thermal Products, STEAG AKTIENGESELLSCHAFT, June 27, 2002: WO/2002/050875

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices ...


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