1
Tetsu Ohsawa: Heat treating apparatus. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, November 7, 1995: US05464313 (96 worldwide citation)

A heat treatment apparatus for semiconductor wafers is provided with a number, such as two, of heat treatment units which are arranged horizontally and which load wafer boats containing wafers from below. A wafer delivery section is provided to correspond to each of the two heat treatment units, and ...


2
Jiro Arima, Hiroji Tsujimura, Tomonori Narita, Hiroki Takebuchi: Method for measuring surface temperature of semiconductor wafer substrate, and heat-treating apparatus. Minolta Camera Kabushiki Kaisha, Tokyo Electron, Oblon Spivak McClelland Maier & Neustadt, December 18, 1990: US04979134 (59 worldwide citation)

A method for measuring the surface temperature of a wafer substrate and a heat-treating apparatus are both used in a semiconductor device-manufacturing process wherein a reference light including infrared rays is intermittently emitted toward a wafer substrate. Infrared rays of a plurality of differ ...


3
Hironobu Nishi: Vertical heat-treating apparatus. Tokyo Electron Sagami, Oblon Spivak McClelland Maier & Neustadt, January 12, 1993: US05178639 (57 worldwide citation)

A vertical heat-treating apparatus which is effective for preventing dust or fine particles from being attached to a wafer during the loading/unloading or transport of the wafer thereby to manufacture a high-quality wafers. This apparatus comprises a carrier stocker storing a plurality of wafer carr ...


4
Eiichiro Takanabe, Takeo Suzuki, Tadataka Noguchi: Vertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatus. Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, February 14, 1995: US05388944 (52 worldwide citation)

A wafer loading and unloading chamber is provided at the bottom of a reaction tube of a heat treatment section, a robot chamber and cassette chamber are coupled via gate valves to the wafer loading and unloading chamber, the robot chamber comprises a first load lock chamber while the wafer loading a ...


5
Lennart Arvid Stenstrom: Heat treating apparatus for liquids. Alfa Laval, Cyrus S Hapgood, January 25, 1977: US04004553 (49 worldwide citation)

One of a plurality of members is rotated by driving means relative to another member around an axis, the members forming between them a narrow passage extending around the rotation axis and serving for through-flow of a liquid to be heat treated, the driving means effecting relative movement between ...


6
Ken Nakao: Heat treating apparatus with cooling fluid nozzles. Tel Sagami, Oblon Spivak McClelland Maier & Neustadt, March 24, 1992: US05097890 (48 worldwide citation)

A cooling system is disclosed which is incorporated in a heat treating apparatus for use in a manufacturing process of a semiconductor device etc. The heat treating apparatus includes a reaction tube for receiving products to be heat treated in its uniformly heated zone, and a heater which surrounds ...


7
Minobu Matsunaga, Yasuhiro Mizohata: Substrate cooling device and substrate heat-treating apparatus. Dainippon Screen Mfg Corp of Japan, Ostrolenk Faber Gerb & Soffen, May 2, 1995: US05411076 (46 worldwide citation)

A treating chamber includes a cooling plate assembly for supporting and cooling a substrate and an auxiliary cooling plate disposed on or adjacent a ceiling of the treating chamber. The auxiliary cooling plate reduces an atmospheric temperature in a space above the substrate supported on the cooling ...


8
Hiroyuki Mitsuhashi, Seishiro Sato, Wataru Ohkase: Heat-treating apparatus. Tel Sagami, Oblon Spivak McClelland Maier & Neustadt, August 21, 1990: US04950870 (44 worldwide citation)

A heat-treating apparatus includes a process tube accommodating an object to be heat-treated therein, and a plurality of independent heaters including at least three heaters arranged at both end portions and the central portion of a side wall of the process tube, so as to surround the process tube a ...


9
Iwao Nakamura, Naoto Nakamura, Sadao Nakashima: Heat treating apparatus. Hitachi Kokusai Electric, Kratz Quintos & Hanson, January 4, 2011: US07865070 (40 worldwide citation)

To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing. The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includ ...


10
Eiichi Shirakawa, Nobuyuki Sata: Heat treating apparatus. Tokyo Electron, Rader Fishman & Grauer, February 20, 2001: US06191394 (33 worldwide citation)

A heat treating apparatus comprises a hot plate having a top surface on which is placed a substrate that is to be subjected to a heat treatment, setting means for setting an original target temperature of the hot plate required for subjecting the substrate to a heat treatment, a heat energy supply s ...



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