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Andrew T Hunt, Tzyy Jiuan Hwang, Helmut G Hornis, Wen Yi Lin: Formation of thin film capacitors. MicroCoating Technologies, March 27, 2001: US06207522 (79 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


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Andrew T Hunt, Wen Yi Lin, Tzyy Jiuan Hwang, Michelle Hendrick, Helmut G Hornis: Formation of thin film capacitors. MicroCoating Technologies, Wayne E Nacker, Alfred H Muratori, S Matthew Cairns, August 13, 2002: US06433993 (61 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


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Andrew T Hunt, Tzyy Jiuan Hwang, Helmut G Hornis, Wen Yi Lin: Formation of thin film capacitors. Shipley Company L L C, S Matthew Cairns, April 27, 2004: US06728092 (49 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


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Hunt Andrew Tye, Flanagan John Scott, Neuman George Andrew: Formation of thin film capacitors. Microcoating Technologies, May 31, 2000: EP1005260-A2 (5 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


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Andrew T Hunt, Tzyy Jiuan Hwang, Helmut G Hornis, Wen Yi Lin: Formation of thin film capacitors. MicroCoating Technologies of, John J Piskorski, c o EDWARDS & ANGELL, October 10, 2002: US20020145845-A1

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


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Hunt Andrew Tye, Flanagan John Scott, Neuman George Andrew, Hwang Tzyy Jiuan, Hornis Helmut G: Formation of thin film capacitors. Micro Coating Technologies, October 21, 2001: TW460608

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


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Hunt Andrew Tye, Flanagna John Scott, Neuman George Andrew, Hwang Tzyy Jiuam, Hornis Helmut Georg, Lin Wen Yi, Hendrick Michelle: Method for forming thin film capacitors from thin layer of dielectric material capable of being deposited by combustion chemical vapor deposition. Micro Coating Technologies, May 19, 2006: KR1020060035864

PURPOSE: Provided is a formation of thin film capacitors, which further enables miniaturization of printed circuit boards because large discrete capacitors are not required any longer during fabrication. CONSTITUTION: A precursor mixture useful in depositing a coating, comprises a precursor disperse ...


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