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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 9, 2008: US07462936 (48 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 19, 2010: US07816251 (3 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Tessera, LERNER DAVID et al, March 19, 2009: US20090071000-A1

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 2, 2005: US20050116326-A1

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Method for making a microelectronic assembly having conductive elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 29, 2018: US09984901

A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and expos ...