1
Richard H Estes, James E Clayton, Koji Ito, Masanori Akita, Toshihiro Mori, Minoru Wada: Flip chip mounting technique. Polymer Flip Chip Corporation, Toray Engineering, Theresa A Lober, June 25, 2002: US06410415 (120 worldwide citation)

The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conducti ...


2
Richard H Estes, Koji Ito, Masanori Akita, Toshihiro Mori, Minoru Wada: Flip chip mounting technique. Polymer Flip Chip, Toray Engineering Co, Theresa A Lober, February 20, 2001: US06189208 (66 worldwide citation)

The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substr ...


3
Richard H Estes, Koji Ito, Masanori Akita, Toshihiro Mori: Flip chip mounting technique. Polymer Flip Chip, Toray Engineering Co, Theresa A Lober, April 24, 2001: US06219911 (60 worldwide citation)

In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into clos ...


4
Yeong Gyu Lee, Jong Hyeong Song, Sang Kyeong Yun, Heung Woo Park, Chang Su Park: Semiconductor package using flip-chip mounting technique. Samsung Electro-Mechanics, Christensen O Connor Johnson Kindness PLLC, June 5, 2007: US07227267 (2 worldwide citation)

A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at po ...


5
Khamvong Thammasouk, Young Seen Lee, Paul Wickboldt: Signal strength enhancement in a biometric sensor array. Synaptics Incorporated, Leydig Voit & Mayer, January 10, 2017: US09542589 (1 worldwide citation)

A biometric imager may comprise a plurality of sensor element traces formed in or on a sensor substrate which may comprise at least a portion of a display screen defining a biometric sensing area and forming in-active pixel locations; an auxiliary active circuit formed in or on the sensor substrate ...


6
Mitsuyoshi Hira, Motoji Tsuda: Elastic wave device. Murata Manufacturing, Keating & Bennett, August 29, 2017: US09748919 (1 worldwide citation)

An elastic wave device includes a piezoelectric substrate, an IDT electrode, and a cover member. The IDT electrode is provided on the piezoelectric substrate. The cover member is provided above the piezoelectric substrate and separate from the IDT electrode. The cover member includes a first cover m ...


7
Junyeong Heo, Chajea Jo, Taeje Cho: Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same. Samsung Electronics, Renaissance IP Law Group, January 23, 2018: US09875992 (1 worldwide citation)

An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrical ...


8
Michael Ayliffe, Yuliya Akulova, Claude Gamache: Multi-laser package using shared optics. Lumentum Operations, Harrity & Harrity, September 26, 2017: US09774172 (1 worldwide citation)

An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relativ ...


9
Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi: Light-reflective anisotropic conductive adhesive and light-emitting device. DEXERIALS CORPORATION, Oliff, January 17, 2017: US09548141

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at le ...


10
Guozhong Shen, Ozan Ersan Erdogan, Taehee Cho: Sensor array with split-drive differential sensing. Synaptics Incorporated, Leydig Voit & Mayer, August 22, 2017: US09740326

A device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising: a plurality of receiver electrodes and a plurality of transmitter electrodes, wherein a transmitter electrode of the plurality of transmitter electrodes comprises a first portio ...