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Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu: Fabricating interconnects and tips using sacrificial substrates. FormFactor, Gerald Linden, Daivd Larwood, November 30, 1999: US05994152 (245 worldwide citation)

Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate esta ...


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I Y Khandros, B N Eldridge, G L Mathieu: Fabricating interconnects and tips using sacrificial substrates. Formfactor, cui yaobeng, February 17, 1999: CN96195559

Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electronic components (784) are not ''at risk'' during the fabrication p ...


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Khandros Igor Y, Eldridge Benjamin N, Mathieu Gaetean L: Fabricating interconnects and tips using sacrificial substrates. Formfactor, Khandros Igor Y, Eldridge Benjamin N, Mathieu Gaetean L, OKAMOTO James K, November 28, 1996: WO/1996/037332

Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electronic components (784) are not 'at risk' during the fabrication pro ...