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Ana Londergan
Khurshid Syed Alam, Evgeni Gousev, Marc Maurice Mignard, David Heald, Ana R Londergan, Philip Don Floyd: Equipment and methods for etching of MEMS. QUALCOMM MEMS Technologies, Knobbe Martens Olson & Bear, September 17, 2013: US08536059 (1 worldwide citation)

Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in ...


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Ana Londergan
Khurshid Syed Alam, Evgeni Gousev, Marc Maurice Mignard, David Heald, Ana R Londergan, Philip Don Floyd: Equipment and methods for etching of mems. Qualcomm Mems Technologies, Knobbe Martens Olson & Bear, September 2, 2010: US20100219155-A1

Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in ...


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Alam Khurshid Syed, Heald David: Equipment and methods for etching of mems. Qualcomm Mems Technologies, Alam Khurshid Syed, Heald David, HART Daniel, August 28, 2008: WO/2008/103632

Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in ...


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Alam Khurshid Syed, Heald David: Equipment and methods for etching of mems. Qualcomm MEMS Technologies, Liu Guowei, January 20, 2010: CN200880005644

Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in ...


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