1
Leping Li, Steven George Barbee, Arnold Halperin: Endpoint detection for chemical mechanical polishing using frequency or amplitude mode. International Business Machines Corporation, Alison D Mortinger, July 1, 1997: US05644221 (59 worldwide citation)

A method and apparatus for endpoint detection in removal of a film from a semiconductor wafer is provided, with a sensor for creating a signal responsive to the film removal process, a positive feedback amplifier coupled to the sensor, the positive feedback amplifier having a mode selector, and an a ...


2
Li Leping, Barbee Steven G, Halperin Arnold: Endpoint detection for chemical mechanical polishing using frequency or amplitude mode. Ibm, October 15, 1997: EP0800896-A2

The apparatus for endpoint detection in removal of a film from a semiconductor wafer, comprises a sensor for creating a signal responsive to the film removal process. A positive feedback amplifier is coupled to the sensor, and has a mode selector. An analyser is coupled to the positive feedback ampl ...