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Hiroshi Yanase, Fukuo Kanno, Takeshi Abe: Encapsulation of electronic device. Asahi Glass Company, Oblon Fisher Spivak McClelland & Maier, January 25, 1983: US04370292 (34 worldwide citation)

An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 ...


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Ameen Joseph George, Buchwalter Stephen Leslie, Kovac Caroline Ann, Palmer Michael Jon, Poore Paige Adams: Conformal sealing and interplanar encapsulation of electronic device structures.. Ibm, November 8, 1989: EP0340492-A2 (19 worldwide citation)

Electronic device packaging structures wherein the active face (6) of an electronic device (4) is mounted facing a substrate (12). Environmental isolation is provided by an overcoat polymeric material (44) at least sealing the space (41) between the device and substrate at the periphery of the devic ...


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DOI KATSUHIRO, OKADA KENICHI, USUI HIROKI: MULTILAYER SHEET FOR ENCAPSULATION OF ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME, MEHRSCHICHTIGE FOLIE ZUR EINKAPSELUNG EINER ELEKTRONISCHEN ANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN ANORDNUNG DAMIT, FEUILLE MULTICOUCHE POUR ENCAPSULATION DE DISPOSITIF ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE DISPOSITIF ÉLECTRONIQUE LUTILISANT.. Fujikura, August 3, 2011: EP2352203-A1 (1 worldwide citation)

The present invention is a sealing laminated sheet for an electronic device in which a first sheet and a second sheet 5 are laminated, wherein the first sheet contains an acid-modified polyolefin-based thermoplastic resin, the second sheet 5 has a melting point higher than that of the first sheet, a ...


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Alexander Heinrich, Peter Scherl, Magdalena Hoier, Hans Joerg Timme: Electronic device and method of fabricating an electronic device. Infineon Technologies, Murphy Bilak & Homiller PLLC, September 5, 2017: US09756726

An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used i ...


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DOI KATSUHIRO: 電子機器の封止用積層シート及びこれを用いた電子機器の製造方法 (JA), Multilayer sheet for encapsulation of electronic device and method for manufacturing electronic device using same (EN). Fujikura, Aoki Hiroaki, February 3, 2011: WO/2011/013389

Disclosed is a multilayer sheet for encapsulation of an electronic device, wherein a first sheet and a second sheet (5) are laminated. The multilayer sheet for encapsulation of an electronic device is characterized in that the first sheet contains an acid-modified thermoplastic polyolefin resin, the ...


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Doi Katsuhiro, Okada Kenichi, Usui Hiroki: Multilayer sheet for encapsulation of electronic device and method for manufacturing electronic device using same. Fujikura, miao kun jin shiyu, May 4, 2011: CN201080001747

Disclosed is a multilayer sheet for encapsulation of an electronic device, wherein a first sheet and a second sheet (5) are laminated. The multilayer sheet for encapsulation of an electronic device is characterized in that the first sheet contains an acid-modified thermoplastic polyolefin resin, the ...